Semi-auto Optical BGA Soldering Machine
1. Product Introduction Single Axis Placement and Soldering Design Split Vision Optics with LED lighting Precision Placement within +/- 0.0002" or 5 microns Force Measurement System with software control 7" touch screen control panel, 800*480 resolution Closed Loop process control In...
Single Axis Placement and Soldering Design
Split Vision Optics with LED lighting
Precision Placement within +/- 0.0002" or 5 microns
Force Measurement System with software control
7" touch screen control panel, 800*480 resolution
Closed Loop process control
In Process Jogging of the Reflow Head
Laser pointer for PCBA positioning
The DH-A2 SMD / BGA Rework Stations feature the latest vision and thermal process control technologies. Printed circuit boards and substrates consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, PoP, Wafer Level Dies, and many other SMD’s are processed with consistently high quality results. Precise mechanics and advanced software simplifies component placement, soldering, and/or rework. Operator involvement is very limited making these systems easy to setup and use. Available in benchtop and standalone configurations, these machines are ideal for prototype R&D, NPI, Engineering, Failure Analysis labs as well as OEM / CEM production environments. Automation, machines' capability, and ease of use are critical for both prototype and production volume applications requiring consistency and quality.
Dinghua Technology is the leading equipment manufacturer for sub-micron die bonding and advanced SMD rework.
Our machines are equally at home in research labs as they are in industrial production.
We offer free training for our customers, we provide 1 year warranty and lifetime technical support.
The rework of BGA components with large ball arrays, processor units (CPU) as well as graphics chips (GPU) and CSP with a fine pitch array demand special device configurations that combine precise thermal management with high placement accuracy and high-resolution optics to ensure rework processes with void-free solder joints and accurate alignment. The demand for more functionalities and performance on smaller PCB continues the trend of miniaturized, increasingly complex devices with extreme packing density and a rising I/O count.
Frequently, BGA rework is used as a synonym for SMD rework. Therefore, many information in this document are not only valid for array packages but SMD rework in general, showing rework strategies for such components and approved Dinghua solutions.