CCD Camera Optical BGA Soldering Machine

1. Product Introduction Automated Z axis with 2 stage programmable speed Precision board holder with vacuum locking base, X-Y micrometers, underside support Compressed air cooling bypassing the heater yields strong, quality joints Four thermocouple inputs Library of predefined profiles Software...

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Product Details

1.Product Introduction

Automated Z axis with 2 stage programmable speed

Precision board holder with vacuum locking base, X-Y micrometers, underside support

Compressed air cooling bypassing the heater yields strong, quality joints

Four thermocouple inputs

Library of predefined profiles

Software controlled process sequencing with safety interlocks

Plug and Operate Configuration

Minimal operator involvement

 

2.Product Specifications


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3.Product Applications

Flip Chip to substrate / PCB via solder attach process

Flip Chip / Die to substrate via thermo compression bonding

Flip Chip / die attachment using non conductive paste

Die to substrate via bumped copper pillars

Conductive epoxy die attachment

BGA/LGA/CCGA/QFN etc.. component rework.

 

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4.Product details



5.Product Qualifications


 

6.Our services

Sample lead time is 5 days.

Large order lead time is 7- 15 days.

We offer free training and 1 year warranty, whole life technical support.

Most competitive price, brand new machine shipped from Dinghua factory.

No intermediate charges, you are dealing with a factory.

 

7.FAQ 

●How does your BGA rework machine guarantee precision alignment of solder ball on chips and soldering joint on PCB?

A: Color optical vision system, with manual x-, Y-axis movement, with split light two-color, zoom in/out and fine-tune function, including color difference resolution device. Display screen clearly display the alignment condition of solder ball on chips and soldering joint on PCB.

●What’s the principal of hot air and infrared heating of your BGA rework machine?

A:There are three independent heaters. Top Hot Air +Bottom Hot Air + Infrared preheating platform. The hot air has the advantage of rapid warming and cooling. The temperature is very easy to control The bottom of the infrared to prevent the PCB deformation (General deformation reasons: Large temperature difference between locations of the PCB and target BGA chip.) This mode of the machine is relatively easy to control and temperature is easy to control.

 

8.Contact us

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