2 Heating Zones Keyboard BGA Soldering Machine
1. Product Introduction (1) 2 temperature zones, top infrared heater, bottom infrared preheating zone (2) With tempering glass, more uniform heating (3) Hot sale model, praised by many customers. (4) Up to 8 segments temperature control, 10 profile groups storage for different BGA's rework...
(1) 2 temperature zones, top infrared heater, bottom infrared preheating zone
(2) With tempering glass, more uniform heating
(3) Hot sale model, praised by many customers.
(4) Up to 8 segments temperature control, 10 profile groups storage for different BGA's rework task.
Top head movement
Up / down, rotate freely.
Taiwan led working light, any angle adjusted.
Store 10 groups of temperature profile
V-groove bracket + universal fixture
K Sensor, Closed loop
Max 270mm*320mm Min 20mm*20mm
3.Product strength and applications
DH-6500 product strength
(1)High precision temperature control, will not lead to null welding or connected welding.
(2)Super high repair success rate, due to high precision temp control and precise optical alignment system.
Wide range of application: can rework BGA, PGA, POP, BQFP, QFN, SOT- 223, PLCC, TQFP, TDFN, TSOP, PBGA, CPGA, LED chip in motherboards of electronic products. Repair success rate 99%.
(1)Multi-functional keyboard control centre
(2)Plus size infrared preheating area, covered with tempering glass, heat more evenly
(3)Limit bar protection
(4)High brightness LED working light
Machines are CE, ISO9001 approved.
All of our BGA rework stations are packed safely for transportation.
1. Your inquiry will be replied in 24 hours ;
2. Offer free spare parts and service within one year of warranty, but all the other relative cost should be on the buyer's account;
3. Technology Support: Provide Demo operation video for training; If you have time, welcome to our company, we will provide the free training;
4. Good and professional after-sales service;
(1) What are BGA chip repairing steps?
1) Taking off the BGA chipset from the PCB motherboard, it is called desoldering.
2) Cleaning the Pad.
3) Cleaning and Reballing the BGA or replace it with a new one directly ---need to use reballing kit and accessories
4) Positioning the BGA chipset ---BGA rework station with optical alignment camera could help you position easily and efficiently.
5) Soldering the BGA chipset onto the PCB
(2) Can I have my LOGO on my products?
A: Yes, We can offer LOGO silk-screen, grave. LOGO fee could be free while order quantity reach requirement.
(3) What is the bulk order delivery time?
A: Bulk Order lead time will be 5-10 working days.