BGA Rework Station For Cellphone Repair

BGA Rework Station For Cellphone Repair

◆ Advanced features ① Top hot air flow is adjustable, to meet the demand of any chips. ② Desoldering, mounting and soldering automatically. ③ Top heating head and mounting head 2 in 1 design. ④ Mounting head with built-in pressure testing device, to protect the PCB from being crushed. ⑤ Built-in vacuum in mounting head pick up BGA chip automatically after desoldering completed.

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Product Details

Dinghua DH-G730 Optical CCD Auto BGA Rework Station for Mobile Phone Motherboard Repair Chip Rework  


Features Summary


☛ Widely used in Chip Level Repairing in mobile phone, small control boards or tiny motherboards etc.

☛ Rework BGA, CCGA, QFN, CSP, LGA, SMD, LED etc.

☛ Automatic desoldering, Mounting and Soldering, automatic pick up chip when desoldering completed.

☛ HD CCD Optical Alignment system for precisely mounting BGA and Components.

☛ BGA mounting accuracy within 0.01mm , Repair success rate 99.9%.

☛ Superior Safety Functions, with Emergency protection.

☛ User-friendly operation, Multi-functional ergonomic system.





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                                                            DH-G730 Specifications

Total power

2500w

3 independent heaters

Top hot air 1200w, lower hot air 1200w

Voltage

AC220V±10% 50/60Hz

Electric parts

7’’ touch screen + high precision intelligent temp control module + stepper motor driver + PLC + LCD display + high resolution optical CCD system

Temperature control

K-Sensor closed-loop + PID automatic temp compensation + temp module,  temp accuracy within ±2℃.

PCB positioning

V-groove + universal fixture + movable PCB shelf

Applicable PCB size

All kinds of mobile phone motherboard

Applicable BGA size

All kinds of mobile phone BGA chip

Dimensions

420x450x680mm (L*W*H)

Net weight

35 Kg


Contact  Information 

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