Touch Screen Ps2 Ps3 Ps4 BGA Rework Station

touch screen ps2 ps3 ps4 bga rework station Quick preview: Original factory price! DH-A1 BGA Rework Machine with IR heater for ps2,ps3,ps4 repairing is now in stock.Our rework station are mainly used in the rework of BGA,CCGA, QFN, CSP, LGA, Micro SMD,LED etc.With multi-funtion and innovative...

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touch screen ps2 ps3 ps4 bga rework station

Quick preview:

Original factory price! DH-A1 BGA Rework Machine with IR heater for ps2,ps3,ps4 repairing is now in stock.Our rework station are mainly used in the rework of BGA,CCGA, QFN, CSP, LGA, Micro SMD,LED etc.With multi-funtion and innovative design, Dinghua machine can make one-stop Romoving,Mounting and Soldering.

 

1. Specification of DH-A1 BGA REWORK STATION

Specification

1

Power

4900W

2

Top heater

Hot air 800W

3

Bottom heater

Iron heater

Hot air 1200W, Infrared 2800W

90w

4

Power supply

AC220V±10%50/60Hz

5

Dimension

640*730*580mm

6

Positioning

V-groove, PCB support can be adjusted in any direction with external universal fixture

7

Temperature control

K type thermocouple, closed loop control, independent heating

8

Temp accuracy

±2 degrees

9

PCB size

Max 500*400 mm Min 22*22 mm

10

BGA chip

2*2-80*80mm

11

Minimum chip spacing

0.15mm

12

External Temperature Sensor

1(optional)

13

Net weight

45kg

 

2.Description of the DH-A1 BGA rework station

1.The top heater and bottom heater is for heating the BGA chip, the infrared heater is for heating the whole PCB, so it can protect the PCB from uneven heating.

2.HD touch screen interface, PLC control.

3.Temperature compensation system--K sensor close loop control and automatic temperature compensation system. It combines with temperature module, which enables temperature accuracy to ±2°C.

4.Hot air nozzles, 360 degree rotation, easy to install and replace, customized is available.

5.V-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board.

6.Powerful cross flow fan, cooling the PCB board efficient after heating, to prevent it from deformation.

7.Sound hint system.There is an alarm before the completion of each desoldering and soldering.


3.Why you should choose Dinghua?

1. Dinghua has more than 10 years experience.

2.Professional and experienced technician team.

3.With high quality product, favorable price and timely delivery.

4.Reply to all your enquiries within 24 hours. 


4. Related Knowledge:

The BGA (Bdll Grid Array) package is a ball grid array package in which an array solder ball is formed at the bottom of a package substrate as an I/O terminal of the circuit and is connected to a printed circuit board (PCB). Devices packaged with this technology are surface mount devices. Compared with traditional foot placement devices such as QFP and PLCC, BGA packages have the following features.

1) There are more I/Os. The number of I/Os in a BGA package is mainly determined by the size of the package and the ball pitch. Since the BGA packaged solder balls are arrayed under the package substrate, the I/O count of the device can be greatly increased, the package size can be reduced, and the assembly footprint can be saved. In general, the package size can be reduced by more than 30% with the same number of leads. For example: CBGA-49, BGA-320 (pitch 1.27mm) compared with PLCC-44 (pitch 1.27mm) and MOFP-304 (pitch 0.8mm), the package size is reduced respectively 84% and 47%.

2) Increased placement yield, potentially reducing costs. The lead pins of traditional QFP and PLCC devices are evenly distributed around the package. The pitch of the lead pins is 1.27mm, 1.0mm, 0.8mm, 0.65mm, and 0.5mm. As the number of I/Os increases, the pitch must be smaller and smaller. When the pitch is less than 0.4mm, the accuracy of SMT equipment is difficult to meet. In addition, the lead pins are easily deformed, resulting in increased mounting failure rates. The solder balls of their BGA devices are distributed in the form of an array on the bottom of the substrate, which can accommodate more I/O counts. The standard solder ball pitch is 1.5mm, 1.27mm, 1.0mm, fine pitch BGA (printed BGA, also known as CSP-BGA, when the pitch of solder balls < 1.0mm, can be classified as CSP package) pitch 0.8mm, 0.65mm, 0.5mm, and now Some SMT process equipment is compatible with a placement failure rate of <10 ppm.

3) The contact area between the array solder balls of the BGA and the substrate is large and short, which is conducive to heat dissipation.

4) The pins of the BGA array solder balls are very short, which shortens the signal transmission path and reduces the lead inductance and resistance, thus improving the performance of the circuit.

5) Significantly improve the coplanarity of the I/O terminals and greatly reduce the losses caused by poor coplanarity in the assembly process.

6) BGA is suitable for MCM packaging and can achieve high density and high performance of MCM.

7) Both BGA and ~BGA are firmer and more reliable than the fine pitch foot-packaged ICs.


5.Detailed Images of DH-A1 BGA REWORK STATION

 

6. Packing & delivery details of DH-A1 BGA REWORK STATION


DH-A1 BGA REWORK STATION PACKING.jpg


  

Delivery detials of DH-A1 BGA REWORK STATION


Shipping:

1.Shipment will be done within 5 business days after receiving payment.

2.Fast delivery shipment by DHL,FedEX,TNT ,UPS and other ways including by sea or by air.

delivery.png  

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