Touch Screen Camera BGA Rework Station

3 heating zones touch screen bga rework machine Quick preview: Promotional price! DH-A1L BGA Rework Machine, equipped with HD touch screen is now in stock. DH-A1L BGA rework station. 1.High success rate of repairing chips 2.Precise temperature control 3.No false welding or fake welding. 4.Three...

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3 heating zones touch screen bga rework machine

Quick preview:

Promotional price! DH-A1L BGA Rework Machine, equipped with HD touch screen is now in stock.

DH-A1L BGA rework station.

1.High success rate of repairing chips

2.Precise temperature control

3.No false welding or fake welding.

4.Three independent heating areas

5.Humanized design

6.Sound hint system

7.Powerful cross flow fan

8.Cooling system

We devoted ourselves to bga rework & automatic machinery,covering most of India, Europe and the American market.We are expecting become your long time partner in China.


1. Specification

 Specification

1

Power

4900W

2

Top heater

Hot air 800W

3

Bottom heater

Iron heater

Hot air 1200W, Infrared 2800W

90w

4

Power supply

AC220V±10%50/60Hz

5

Dimension

640*730*580mm

6

Positioning

V-groove, PCB support can be adjusted in any direction with external universal fixture

7

Temperature control

K type thermocouple, closed loop control, independent heating

8

Temp accuracy

±2 degrees

9

PCB size

Max 500*400 mm Min 22*22 mm

10

BGA chip

2*2-80*80mm

11

Minimum chip spacing

0.15mm

12

External Temperature Sensor

1(optional)

13

Net weight

45kg


2.Main features of the DH-A1L BGA rework station

Scientific & Smart

1, There are 3 independent heating areas, hot-air heaters+ IR preheating area which can heat stably and fast while prevent PCBA from deformation

2. Top heater air volume , bottom heater height and IR preheating area could be adjusted to apply to different kinds of BGA repairing.

3, Equipped with different sizes of titanium alloy BGA nozzles, can be rotated 360 degree, easy to place and change.

4, Can set 6 segments of rising temperature and 6 segments of constant temperature,can memory N groups of temp profiles, which can be used at any time.

 

3.Why you should choose DH-A1L BGA rework station?


A1L bga rework station advantages.jpg


4. Related Knowledge:

Surface mount land preparation should be performed prior to the installation/replacement of a new surface mount component. Avoidance of thermal and/or mechanical damage to the land and sub-strate is critical. The two primary steps include:

- Remove Old Solder

This may be performed with a soldering iron and braided solder wicking material, or with a continuous vacuum Flo Desoldering technique employing a solder extractor and a special Flo-D-Sodr tip which allows reflow and vacuum removal of the old solder to occur continuously.

-Clean lands

Old flux residues left over after the removal of old solder are cleaned in this step prior to adding new solder.

-Add New Solder

This step is part of the Component Installation process and is accomplished by either prefilling (pretinning) the lands (by reflowing wire solder with a soldering iron or some other heating method), or by applying solder paste (cream) with a dispenser prior to (or after) the component is placed on the land pattern.

The quantity of solder applied is critical to achieving acceptable joints. For instance, acceptable J-lead solder joints require much more solder than acceptable gull wing lead solder joints.


Surface Mount Components

-Pre-/auxiliary heat assembly and/or component if required

-Evenly apply heat in a rapid, controllable fashion to achieve complete, simultaneous reflow (melt) of all solder joints

-Avoid thermal and/or mechanical damage to component, board, adjacent components and their joints

-Immediately remove component from board before any solder joint re-solidifies

-Prepare lands for replacement component

Thru-hole Components

Desoldering component one joint at a time using continuous vacuum method

-Pre-/auxiliary heat assembly and/or component if required

-Heat joint in a rapid, controllable fashion to achieve complete solder reflow

-Avoid thermal and/or mechanical damage to component, board, adjacent components and their joints

-Apply vacuum during lead movement to cool joint and free lead

Desoldering component using solder fountain method

-Reflow all joints in solder fountain

-Remove old component and either immediately replace with new component, or clear thru-holes for component replacement later


5.Detailed Images of DH-A1L BGA REWORK STATION


A1L bga rework station detailed image.jpg

 

6.Packing & delivery details of DH-A1L BGA REWORK STATION


pack.jpg


   

Delivery detials of DH-A1L BGA REWORK STATION


Shipping:

1.Shipment will be done within 5 business days after receiving payment.

2.Fast delivery shipment by DHL,FedEX,TNT ,UPS and other ways including by sea or by air.

 

delivery.png

7. FAQ

Q:How to distinguish between leaded and lead-free chips?

A: 1.Distinguish from the surface of the chip printing. Such as Intel series south bridge, FW82801DBM NH82801DBM, the former is leaded, the latter is lead-free, with FW and NH being the difference.

2.RoHS-labeled on the device or on the PCB are lead-free certified products.

3. RoHS scope: Only for new products launched after July 1, 2006. Basically, motherboards and notebooks produced after 2007 are all lead-free.

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