Semi Automatic Optical Camera BGA Reballing Machine

Semi Automatic Optical Camera BGA Reballing Machine

Dinghua DH-A2 Semi-Automatic BGA Rework Station. Optical Camera. Hot air and infrared heating. 100% safety system.

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Semi Automatic Optical Camera BGA Reballing Machine

Semi Automatic Optical Alignment BGA Reballing Machine

Semi Automatic Optical Alignment BGA Reballing Machine


1. Product Features of Semi Automatic Optical Camera BGA Reballing Machine

Semi Automatic Optical Alignment BGA Reballing Machine

• High degree of automation.

•High successful rate of repairing due to precise temperature control and precise alignment of every soldering joint.

•Two hot air heating zones and one infrared preheating zone create even and focused heating.

Temperature is controlled strictly. PCB won't crack or turn yellow because temperature rises gradually.

 

2.Specification of Semi Automatic Optical Camera BGA Reballing Machine

Semi Automatic Optical Alignment BGA Reballing Machine


3.Details of Semi Automatic Optical Camera BGA Reballing Machine

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4.Why Choose Our Semi Automatic Optical Camera BGA Reballing Machine?

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5.Certificate of Semi Automatic Optical Camera BGA Reballing Machine

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

Semi Automatic Optical Alignment BGA Reballing Machine


6.Packing for Semi Automatic Optical Camera BGA Reballing Machine

Semi Automatic Optical Alignment BGA Reballing Machine


7. Shipment of Semi Automatic Optical Camera BGA Reballing Machine

Fast and safe DHL/TNT/UPS/FEDEX

Other shipment terms are acceptable if you need.

Semi Automatic Optical Alignment BGA Reballing Machine

8. Payment terms for Semi Automatic Optical Camera BGA Reballing Machine.

Bank transfer, Western Union, Credit card. 

Shipment will be arranged with 5-10 business after placing orders.


9.Contact us for Semi Automatic Optical Camera BGA Reballing Machine

Semi Automatic Optical Alignment BGA Reballing Machine
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10.Related knowledge about motherboard repairing

 

Step 1: Cleaning

The first thing to note is that dust is one of the biggest enemies of the motherboard. It is best to pay attention to dust. Use a brush to gently brush the dust on the motherboard. In addition, some cards on the motherboard and chips are in the form of pins, which often lead to poor contact due to oxidation of the pins. Use an eraser to remove the surface oxide layer and re-plug it. Of course, we can use trichloroethane - a good volatility, one of the liquids for cleaning the motherboard. There is also a sudden power failure, you should immediately turn off the computer, so as not to suddenly call the motherboard and power supply burned. Process.


Step 2: BIOS

        Due to improper BIOS settings, if overclocking... you can jump to clear the line and pick it up again. If the BIOS is corrupted, such as a virus intrusion..., you can rewrite the BIOS. Because the BIOS cannot be measured by the instrument, it exists in the form of software. In order to eliminate all the causes that may cause problems on the motherboard, it is best to brush the motherboard BIOS.


Step 3: Plug and Swap Exchange


There are many reasons for the host system to fail. For example, the motherboard itself or various card failures on the I/O bus can cause the system to malfunction. The plug-and-play maintenance method is a simple method to determine the fault on the motherboard or I/O device. The method is to shut down the plug-in board one by one, and each time a board is pulled out, the machine is running to observe the running state of the machine. Once the board is operated normally after pulling out a certain block, the fault is caused by the fault of the board or the corresponding I/O bus slot. And the load circuit is faulty. If the system startup is still not normal after all the boards are removed, the fault is likely to be on the motherboard. The exchange method is basically to exchange the same type of plug-in board, the bus mode is the same, the same function of the plug-in board or the same type of chip mutual chip exchange, according to the change of the fault phenomenon to determine the fault. This method is often used in easy-to-plug maintenance environments, such as memory self-test errors, which can be exchanged for the same memory chip or memory module to determine the cause of the failure.


Step 4: Watch


Get a faulty motherboard and first use your eyes to scan it to see if there are no signs of burnout. The appearance is not damaged. Look at whether the plugs and sockets are skewed, whether the resistors and capacitor pins touch each other, whether the surface is burnt, and the surface of the chip. Whether it is cracked, whether the copper foil on the motherboard is blown. Also check to see if any foreign objects fall between the components of the motherboard. In the case of doubt, you can use the universal meter to measure it. Touch the surface of some chips, if it is abnormally hot, you can try another chip.


(1). If the connection is broken, we can use a knife to scrape the paint off the broken line, apply wax on the exposed wire, and then use the needle to follow the trace to remove the wax, then drop the silver nitrate solution on it. Then use the universal meter to confirm whether to connect the breakpoints. Just one by one, you can connect the breakpoints. Pay attention to one by one, don't worry, the distance between the traces on the main board is very small, if it is not good, it will be short-circuited.

(2). If it is an electrolytic capacitor, you can find a matching replacement.


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