Phone Repair PS3 BGA Rework Station

Phone Repair PS3 BGA Rework Station

◆ Advanced features
① Top hot air flow is adjustable, to meet the demand of any chips.
② Desoldering, mounting and soldering automatically.
③ Built-in infrared laser positioning, help fast positioning for PCB.
④ Top heating head and mounting head 2 in 1 design.
⑤ Mounting head with built-in pressure testing device, to protect the PCB from being crushed.
⑥ build-in vacuum in mounting head pick up BGA chip automatically after desoldering completed.

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Product Details

BGA Rework Station Motherboard Rework Station for TV/Laptop/PS3/Xbox360/Cell Phone


Features Summary

☞ Widely used in Chip Level Repairing in laptop, PS3, PS4, XBOX360, Moblie Phone, Computer, TV, control boards etc.
☞  Rework BGA, CCGA, QFN, CSP, LGA, SMD, LED etc.
☞  Automatic desoldering, Mounting and Soldering, automatic pick up chip when desoldering completed.
☞  HD CCD Optical Alignment system for precisely mounting BGA and Components.

☞  BGA mounting accuracy within 0.01mm , Repair success rate 99.9%.
☞  Laser Positioning for Fast Positioning BGA Chip and motherboard.
☞  Superior Safety Functions, with Emergency protection.
☞  User-friendly operation, Multi-functional ergonomic system.


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                                                                 Specifications

1

Total power

5300w

2

3 independent heaters

Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 2700w

3

Voltage

AC220V±10% 50/60Hz

4

Electric parts

7’’ touch screen + high precision intelligent temp control module + stepper motor driver + PLC + LCD display + high resolution optical CCD system + laser positioning

5

Temperature control

K-Sensor closed-loop + PID automatic temp compensation + temp module,  temp accuracy within ±2℃.

6

PCB positioning

V-groove + universal fixture + movable PCB shelf

7

Applicable PCB size

Max 370x410mm Min 22x22mm

8

Applicable BGA size

2x2mm~80x80mm

9

Dimensions

600x700x850mm (L*W*H)

10

Net weight

70 Kg

Packing & Delivery 




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