Optical Playstation BGA Rework Station

optical playstation bga rework station 1. Quick preview: With easy to operate system, the DH-G600 optical playstation bga rework station is designed with HD Optical Alignment system to ensure the accuracy of mounting BGA and Components and aimed to help operator to master how to use within few...

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Product Details

optical playstation bga rework station

1. Quick preview:

With easy to operate system, the DH-G600 optical playstation bga rework station is designed with HD Optical Alignment system to ensure the accuracy of mounting BGA and Components and aimed to help operator to master how to use within few minutes.

If you are looking for a bga rework station for mobile phone repairing, congratulation! You’ve find the original factory. Dinghua, may be the best brand of bga rework station around the world.


Product parameter

Product name

soldering and desoldering machine

Total power

5300W

top heating

1200w

bottom heating

bottom hot air heating 1200W, IR preheating 2700W

Power

220V 50HZ/60HZ

Positioning

V-groove, PCB boards can be adjusted in X, Y axis and equipped with universal fixture

Temperature control

K-type, Closed loop

PCB size

Max 400x380mm, Min 22x22mm

Chip size

2x2-50x50mm

Minimum chip spacing

0.15mm

External temperature sensor

1(optional)

N.W.

approx 60kg

Suitable motherboards

mobile phone, laptop, desktop, game console, XBOX360, PS3


3. The main features of DH-G600 BGA rework station


01, "Embedded industrial computer, high-definition touch screen man-machine interface, digital system settings, intelligent man-machine dialogue, PLC control, self-selected storage, call the temperature curve, with "temperature retention *. "Instantaneous curve analysis" "Welcome to remind when the demolition down" function, real-time display settings and measured temperature curve, and the curve can be analyzed and corrected.

 

02, High-accuracy K-type thermocouple closed-loop control and PID temperature automatic compensation system, combined with PLC operation unit and temperature module to achieve accurate temperature control, keep the temperature deviation at ± 2 degrees while external

03, using high-precision digital video pair Bit system, HD CCD imaging, coordinate positioning, intelligent heating temperature control: Linear carriages are used to make x. Y, Z three axes can be used for fine-tuning or quick positioning, convenient, Holley 1-full CE board layout and different size PCB board positioning.

 

DH-G600 BGA Rework Station Real repairing performance :

Below picture shows the genuine success rate based on 20 pcs each of four kinds IC. The success rate of one-time rework of BGA reached 100%.


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4.Detailed Images of G600 BGA REWORK STATION


Camera.jpg

HD Optical CCD Lens Alignment System

The camera is imported from Panasonic, Japan to ensure the replacement accuracy at ±0.01mm

heating head.png


Mounting head with built-in pressure testing device , to protect the PCB from damage.

build-in vacuum in mounting head pick up BGA chip automatically after desoldering completed

 

screen.png 

With top air flow adjust, to prevent tiny bga from blew away.


working area.jpg

PCB Positioning: V-groove, PCB boards can be adjusted in X, Y axis and equipped with universal fixture


5.Advantages

Eight reasons customers choose our company:

1. Our company was founded in 2011, specializing in BGA rework station and automation solution.

2. Our products of the brands "DINGHUA" sell well both at home and abroad.

3. We serve customers sincere, warm services, efficient and professional advices

4. Our company is a reliable "one-stop" purchasing window.

5. We adhere to the "LONGLIFE" concept of quality, makes you no worry about after sale.

6. Factory supply directly, with better prices.

7. Dinghua was composed of senior sales team and a scientific management system.

8. We have the valuable culture of "Integrity, exploration, sharing and mutual benefits


6. Packing & Delivery & Services of G600 BGA REWORK STATION

Delivery policy : Normally,it takes about 3 working days to USA and 4 days to European countries ,and more than 3 days for slow expresses. We can ship as your request and help to find the most cost-efficient and fast way.

Once upon delivery, We will send your tracking Number immediately.


 


7. FAQ of the G600 BGA REWORK STATION

Q:How to contact us to solve your questions?

A: Any question,pls leave us ""Inquiry""& click ""Chat Now"" to know more details (price & discount & free gifts) ,I'll reply you at the first time.

If u want to know more about our machine, please contact us,We are always ONLINE to serve your inquiry.  

Mob/WhatsApp/Wechat: +86 13652339539"

 

Q:How to use ?

A: 1.Don't worry.We will provide u English instruction book and Demo Video to see how to use.

2. About the temperature setting ,pls refer to the setting of the temperature parameters manual here and to see how to set temperature

 

Q: Do you accept OEM order?

A: Yes, OEM & ODM are acceptable.


8. Services

* Your inquiries related to our products will be replied within 24 hours.

* OEM&ODM are welcome, OEM brand is available.

* Protection of your sales area, ideas of your design and all your private information.

* View our Factory.

* Training how to instal the machine, training how to use the machine.

* Engineers available to service machinery overseas.

 

9. Related knowledge

Reflowing and reballing

X-ray picture of good solder joints.

Good solder joints between BGA and PCB

Ball grid arrays (BGA) and chip scale packages (CSA) present special difficulties for testing and rework, as they have many small, closely spaced pads on their underside which are connected to matching pads on the PCB. Connecting pins are not accessible from the top for testing, and cannot be desoldered without heating the whole device to the melting point of solder.

After fabrication of the BGA package, tiny balls of solder are glued to the pads on its underside; during assembly the balled package is placed on the PCB and heated to melt the solder and, all being well, to connect each pad on the device to its mate on the PCB without any extraneous solder bridging between adjacent pads. Bad connections produced during assembly can be detected and the assembly reworked (or scrapped). Imperfect connections of devices which are not themselves faulty, which work for a time and then fail, often triggered by thermal expansion and contraction at operating temperature, are not infrequent.

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