Optical Macbook BGA Rework Station

1. Automatically solder, desolder and mount BGA IC chip with optical alignment system and 3 heating area.
2. High success rate of repairing.
3. Suitable for PCB size:Max450*490,Min22*22mm.
4. Suitable for Chip size:80*80-1*1mm

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Product Details

Optical Macbook BGA Rework Station


1.Application of  Optical Macbook BGA Rework Station

Suitable for different PCB.

Motherboard of computer, smart phone, laptop, MacBook logic board, digital camera ,air conditioner, TV and other electronic equipments from medical industry, communication industry, automobile industry, etc.

Suitable for different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.

2.Product Features of Optical Macbook BGA Rework Station

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• Desoldering, mounting and soldering automatically.

•High success rate of repairing chip and PCB.

•The machine won’t damage to surrounding components around the target chip on PCB due to strict temperature control.

• Precise optical alignment system

zoom in/out and micro-adjust, equipped with aberration detection device, with auto focus and software operation

• Three independently controlled heaters. it can heat PCB board and bga chips at the same time. And the third IR heater can preheat the PCB board from bottom evenly, to avoid PCB from deformation during repair process. All three heaters can heat independently . Top and bottom heaters are hot-air heating, the third is infrared preheating zone.


3.Specification of Optical Macbook BGA Rework Station

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4.Details of Optical Macbook BGA Rework Station

CCD camera( precise optical alignment system) ; 

2.HD digital display ; 

3. Micrometer (adjust angle of chip) ; 

4.3 independent heaters ( hot air & infrared ) ;

5. Laser positioning ;

6. HD touch screen interface , PLC control ; 

7.Led headlamp ; 

8.Joystick control .

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5.Why Choose Our Optical Macbook BGA Rework Station? 

6.Certificate of  Optical Macbook BGA Rework Station

To offer quality products, SHENZHEN DINGHUA TECHNOLOGY DEVELOPMENT CO.,LTD was the first to pass UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

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7.Packing & Shipment of Optical Macbook BGA Rework Station

8.Contact us

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• Will the top head of the machine fall down to fast then break the chip and PCB?

A:To protect the PCB and chip from being crushed, there is built-in pressure testing device in mounting head. Once the pressure testing device detect any pressure, the top head of the machine will stop automatically.


•During heating process, the temperature is very high. After the heating process is finished, do I need to pick chip on PCB?

A: Build-in vacuum in mounting head pick up BGA chip automatically after desoldering completed.


•What happen if the chip is dropped down on the heating area accidently? Will it be too hard to take it out? Will it be burnt ?

Infrared preheating area is covered by steel mesh. This is to prevent chips from falling down on the hot heating area.

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    Contact Us
  • +86-0755-29091822
  • Sales31@dinghua-bga.com
  • 4th Floor, Block 6B, Shengzuozhi Industrial Park, Xinyu Road, Shajin, Baoan, Shenzhen, China