IR Optical BGA Rework Station
1. Product Introduction The flexible rework powerhouse for challenging tasks · Powerful hot air heating in the top emitter 1,200 W · Power full hot air heating in the lower emitter 1,200 W · Strong infrared preheating in the bottom emitter 2,700 W · Four thermocouple measuring channels for...
1. Product Introduction
The flexible rework powerhouse for challenging tasks
· Powerful hot air heating in the top emitter 1,200 W
· Power full hot air heating in the lower emitter 1,200 W
· Strong infrared preheating in the bottom emitter 2,700 W
· Four thermocouple measuring channels for precise temperature measuring
· Dynamic IR heating technology for large (370 x 450 mm) PCBs
· High precision (+/- 0.025 mm) Auto Pick & Place with motor zoom AF camera
· Intuitive operation with 7’’ touch screen 800*480 resolution panel
· Build-in USD2.0 port
· Motor zoom reflow process camera for process viewing
· Advanced chip auto feeding system
2. Product Specifications
3. Product Applications
Dinghua DH-A2E is an enhanced hot air rework station for assembly and rework of all types of SMD components.
The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allows all rework process steps within one system. The DH-A2E system is at home in R&D, process development, prototyping and production environments.
Application area from 01005 up to large BGA on small to medium sized PCBs, with the goal to have highly reproducible soldering results.
Industry-leading thermal management
High efficiency board heater
Closed loop force control
Automated top heater calibration
4. Product details
5. Product Qualifications
6. Our services
Dinghua is a recognized world leader in the development of solutions for the assembly and repair of highly advanced electronics. Today, Dinghua continues to provide innovative solutions, products and training for the rework and repair of printed circuit assemblies. Our unique capabilities and evolving vision have provided universal solutions to thru-hole and surface mount assembly and rework problems for the most advanced electronics.
Our strong commitment and history of achievement has resulted in an unparalleled range of Assembly, Repair solutions to meet your needs whether working to IS0-9000, industrial, military or your own internal specifications. Whatever the challenge, Dinghua stands ready to set a new standard for you.
Dinghua - 10 years of experience and industry leadership, providing solutions and systems for soldering, rework, and repair of electronics.
Electronic Devices and Gadgets are getting smaller and slimmer day by day. All this is possible because of technological progress and development in electronics. Top Electronic Companies in the World are in competition to make the smallest and slimmest gadgets. SMDs or Surface Mount Devices and BGA or Ball Grid array are two electronic components responsible for making electronic devises and gadgets smaller and slimmer.
Let us understand BGA. What is BGA (Ball Grid Array) and Why BGA?
BGA or Ball Grid Array is one type of packaging for Surface Mount Technology (where SMD electronic components are actually ‘mounted’ or affixed on the surface of the SMT printed circuit board). A BGA package has no leads or pins. The Ball Grid Array gets its name because it is basically an array of metal alloy balls arranged in a grid. These BGA Balls are normally Tin/Lead (Sn/Pb 63/37) or Tin/Lead/Silver (Sn/Pb/Ag).
BGA offer many advantages over SMDs or Surface Mount Devices:
The PCB or Printed Circuit Board in today’s electronic devices and gadgets densely populated with electronic components. The size of the Circuit Board will increase with increase in number of electronic components. In order to squeeze the size of the PCB, SMDs and BGA Packages are used because both SMDs and BGAs are smaller and slimmer in size and occupy very little space on the PCB. BGA components provide better solution for many circuit boards, but care is required when soldering BGA components to ensure that the BGA solder process is correct and is reliable.
BGA also offers following advantages:
Improved PCB design as a result of lower track density.
The BGA package is robust.
Lower thermal resistance.
Improved high speed performance and connectivity.
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