How BGA Machine Works
1. We can offer free training to show How BGA machine works. 2. Lifetime technical support can be offered. 3. Professional training CD and manual come with the machine. 4. Welcome to visit our factory to test our machine
How Automatic BGA machine works?
1.Application Of Automatic BGA Machine
Work with all kinds of motherboards or PCBA.
Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.
2.Product Features of Automatic BGA Machine
3.Specification of Automatic BGA Machine
4.Details of Automatic BGA Machine
5.Why Choose Our Automatic BGA Machine ?
6.Certificate of Automatic BGA Machine
UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.
7.Packing & Shipment of Automatic BGA Machine
8.Shipment for Automatic BGA Machine
DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.
9. Terms of Payment
Bank transfer, Western Union, Credit Card.
Please tell us if you need other support.
10. How DH-A2 Semi Automatic BGA Machine works?
11. Related knowledge
SMT technology: adding solder paste
The purpose is to apply an appropriate amount of solder paste uniformly on the specified pads of the PCB to ensure that the pads corresponding to the PCB components and the PCB have good connection effect and sufficient soldering strength during reflow soldering.
Solder paste is a paste with a certain viscosity, which is a mixture of various metal powders, paste soldering machines and some fluxes. At normal temperature, because the solder paste has a certain viscosity, the electronic components can be adhered to the corresponding pads on the PCB. In the case where the tilt angle is not too large and there is no external force collision, the general components will not move. When the solder paste is heated to a certain temperature, the flux in the solder paste is volatilized to remove impurities and oxides from the pad and the metal portion of the device, and the metal powder is melted and converted into a solder paste to flow, and the solder paste is wetted. The end and the PCB pad, the soldered end of the component after cooling and the pad are soldered together to form an electrical and mechanical solder joint. Rapid cooling is required during cooling to avoid oxidation of the solder paste combined with oxygen in the air, which affects the welding strength and electrical effects.
Solder paste is applied to the pad by special equipment. Currently, the equipment for applying solder paste is: fully automatic visual printer, semi-automatic printer, manual printing station, etc.