Hot Air Infrared BGA Machine Price
1. Perfect solution for LED,BGA,QFN,SMD SMT Rework. 2. Hotsale model: DH-A2 3. Repairing mobile motherboard, laptop motherboards, PS3,PS4 motherboards. 4. CCD Camera Optical alignment system works with auto feeding system.
Automatic Optical Hot Air Infrared BGA machine price
1.Application Of Automatic Hot Air Infrared BGA machine price
Work with all kinds of motherboards or PCBA.
Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.
2.Product Features of Automatic Hot Air Infrared BGA machine price
3.Specification of Automatic Hot Air Infrared BGA machine price
4.Details of Automatic Hot Air Infrared BGA machine price
5.Why Choose Our Automatic Hot Air Infrared BGA machine price?
6.Certificate of Automatic Hot Air Infrared BGA machine price
UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.
7.Packing & Shipment of Automatic Hot Air Infrared BGA machine price
8.Shipment for Automatic Hot Air Infrared BGA machine price
DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.
9. Terms of Payment
Bank transfer, Western Union, Credit Card.
Please tell us if you need other support.
10. Operation guide for Automatic Hot Air Infrared BGA machine
11. Related knowledge
Manual soldering and disassembly of patch components
With the above tools, it is not difficult to solder and remove the patch components. For components with only 2 – 4 feet, such as resistors, capacitors, diodes, triodes, etc., first plate a tin on one of the pads on the PCB, then place the left hand with the tweezers to place the component and place it against the board. The right hand solders the pins on the tinned pads with a soldering iron. After the component is welded to one foot, it will not move. The left hand tweezers can be loosened, and the remaining wires are welded by using tin wire. It is also very easy to disassemble such components. Just use two soldering irons (one for each of the left and right hands) to heat both ends of the member at the same time. After the tin is melted, the components can be removed by gently lifting them.
For patch components with many pins but wide spacing (such as many SO-type ICs with a number of pins between 6 and 20 and a pitch of 1.27mm), a similar approach is used. Tin-plated, then the left hand is welded with a pair of tweezers to weld one foot, and then the remaining feet are soldered with tin. The disassembly of such components is generally better with a heat gun, a hand-held hot air gun blows the solder, and the other hand removes the component with a clamp such as a tweezers.
For components with high pin densities (such as 0.5mm pitch), the soldering step is similar, that is, soldering one foot first, then soldering the remaining legs with tin. However, for such components, because the number of pins is relatively large and dense, the alignment of the pins with the pads is critical. After tinning a pad (usually the pad on the corner, only a small amount of tin is plated), align the component with the pad with tweezers or hands, taking care to align all the pins with the pins (here The most important thing is patience!), then press the component on the PCB with a little effort (or by tweezers), and solder the corresponding pin on the right hand with a soldering iron. After soldering, the left hand can be loosened, but do not shake the board vigorously, but gently turn it to solder the pins on the remaining corners first. When the four corners are soldered, the components will not move at all, and the remaining pins can be soldered one by one. When welding, you can first apply some loose perfume, let the iron tip with a small amount of tin, and solder one pin at a time. If you accidentally short the adjacent two feet, don't worry, wait until all the welding is done, then use the braid to clean the tin. Of course, the mastery of these skills is to be practiced. If there is an old circuit board, the old IC may be used for practice.
For the removal of high pin density components and BGA chips, the hot air gun is mainly used, and the hot air gun is adjusted to about 300 degrees to blow all the pins back and forth, and the components are lifted when they are melted. If the removed component is still needed, then try not to face the center of the component when blowing, and the time should be as short as possible. After removing the components, clean the pads with a soldering iron. If you are not sure about your own soldering, you can find a professional electronic engineer Deng Gong to help.