BGA Rework Station SP360c PS3 PS4

BGA Rework Station SP360c PS3 PS4

1. Effective repairing motherboards of PS3,PS4,SP360C,mobile, laptop. 2. Cross-flow cooling fan ensure automatic cooling function, which ensure long lifespan and avoid damage. 3. Infrared laser positioning helps position motherboard easily and fast. 4. High definition Touch screen.

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Product Details

Automatic Optical BGA Rework Station for SP360c PS3 PS4

bga soldering station

Automatic BGA Soldering Station with optical alignment

1.Application Of Automatic BGA Rework Station for SP360c PS3 PS4

Work with all kinds of motherboards or PCBA.

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.


2.Product Features of Automatic BGA Rework Station for SP360c PS3 PS4

Automatic BGA Soldering Station with optical alignment

 

3.Specification of Automatic BGA Rework Station for SP360c PS3 PS4

Laser position CCD Camera BGA Reballing Machine

4.Details of Automatic BGA Rework Station for SP360c PS3 PS4

ic desoldering machine

chip desoldering machine

pcb desoldering machine


5.Why Choose Our Automatic BGA Rework Station for SP360c PS3 PS4? 

motherboard desoldering machinemobile phone desoldering machine


6.Certificate of Automatic BGA Rework Station for SP360c PS3 PS4

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

pace bga rework station


7.Packing & Shipment of Automatic BGA Rework Station for SP360c PS3 PS4

Packing Lisk-brochure



8.Shipment for Automatic BGA Rework Station for SP360c PS3 PS4

DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.


9. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 


10. Operation guide for Automatic BGA Rework Station for SP360c PS3 PS4




11. Related knowledge

Bubble treatment during rework


In assembly with bottom termination elements (BTC), the presence of air bubbles has been a very serious problem for many applications. For the definition of bubbles, the following is a description of the welding defects:


[...] Tin melt quickly fills the appropriate vacancies and captures some flux in the solder joints. These trapped flux bubbles are hollow; [...] These voids prevent the filling of the tin. In such solder joints, the solder cannot fill the entire solder joint because the flux has been sealed inside. [1]


In the SMT field, bubbles can only produce the following effects: [...] Since there is very little solder that can be applied to each solder joint, the reliability of solder joints is more concerned. The presence of bubbles has been a common drawback associated with solder joints, especially during reflow soldering of SMT. The presence of bubbles can exacerbate the strength of the solder joints and ultimately lead to solder joint failure. [2]


The impact on the quality of the formation of bubbles in solder joints has been reported many times in many discussions:


• Reduced heat transfer from component to PCB, increasing the risk of excessive component body temperature


• Reduced mechanical strength of solder joints


• Gas instinct escape in the solder joint – can cause solder splash


• Affect the current carrying capacity of the solder joint (ampere capacity) – the junction temperature is too high due to the increased resistance of the solder joint


• Affect the transmission of signals – in high frequency applications, the bubbles will weaken the signal


Especially in power electronics, the generation of bubbles on thermal pads (such as QFN package components) has become an increasing problem at this stage. Heat needs to be transferred from the component to the PCB for heat dissipation. This important process cannot be achieved, which significantly shortens the life of the component.


Remove some conventional methods of reducing bubbles: such as using low-bubble solder paste, optimizing the reflow profile, and optimizing the opening of the stencil to achieve the best amount of solder paste, and a bubble when the solder paste is in the liquid state. The solution is also a new option throughout the electronic assembly process.


So the question is, how do you apply the bubble treatment process to an open environment like rework equipment? The vacuum technology used for reflow soldering is clearly not applicable. A technique based on sinusoidal excitation of a PCB substrate is more suitable for rework (Figure 1). The first is that the PCB is excited by a longitudinal wave with a amplitude of less than 10 μm. This sine wave excites the PCB at a set frequency. In this region, both the PCB body and the solder joints on the PCB are self-resonant by this stress. When the PCB is scanned by energy, the components remain in place and the bubbles are trapped in the edge regions of the liquid solder and have the ability to escape from the solder joints.


In this way, it is possible to reduce the bubble ratio to 2% in the welding of new components (Fig. 2). Even with this technique, significant bubble removal can be performed on the target solder joints on the assembled PCB during the secondary reflow process. In this re-bubble rework process, only the selected area on the PCB is heated to the reflow state, and only this area is sinusoidally excited, so there is no negative impact on the entire product.


Scanning waves are longitudinally advanced along the PCB substrate


The excitation is performed by a linear scanning wave produced by a piezoelectric actuator.

1. Handle bubbles in PCBA with a piezo driver

2. Turn on the excitation function during reflow to significantly reduce the proportion of bubbles in the MLF (before and after application).


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