Automatic SMD SMT LED BGA Workstation

Automatic SMD SMT LED BGA Workstation

1. Best solution for SMD SMT LED BGA rework 2. Perfect SMT solution provider 3. 3 warranty for heating system 4. From largest manufacturer of BGA rework station

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Product Details

Automatic SMD SMT LED BGA Workstation

bga soldering station

Automatic BGA Soldering Station with optical alignment

1.Application Of Automatic SMD SMT LED BGA Workstation

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.


2.Product Features of Automatic SMD SMT LED BGA Workstation

Automatic BGA Soldering Station with optical alignment

* Stable and long lifespan

* Can repairing different motherboards with high successful rate

* Strictly control heating and cooling temperature

* Optical alignment system: mounting accuracy within 0.01mm

* Easy to operation. Can learn to use in 30 minute. No special skill is needed.

 

3.Specification of Automatic SMD SMT LED BGA Workstation

Laser position CCD Camera BGA Reballing Machine

4.Details of Automatic SMD SMT LED BGA Workstation

ic desoldering machine

chip desoldering machine

pcb desoldering machine


5.Why Choose Our Automatic SMD SMT LED BGA Workstation? 

motherboard desoldering machinemobile phone desoldering machine


6.Certificate of Automatic SMD SMT LED BGA Workstation

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

pace bga rework station


7.Packing & Shipment of Automatic SMD SMT LED BGA Workstation

Packing Lisk-brochure



8.Shipment for Automatic SMD SMT LED BGA Workstation

DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.


9. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 


10. Operation guide for Automatic SMD SMT LED BGA Workstation



11. Related knowledge

DIP vs SMD vs COB encapsulation principle,

LED chip light source, also known as the lamp bead, consists of two parts: the chip and the package. The chip refers to the LED light-emitting part. There is only one sesame grain size. The part that wraps it is called the package, usually in the package. Apply a layer of phosphor to make a different color temperature.


LED chip-based light sources have three main packaging modes: pin-in type (DIP), surface mount (SMD), and chip integrated package (COB).

The characteristics of this package are:


Low voltage and good safety

Low loss, high energy consumption and long life

High brightness, low heat

Multi-color dimming, stable performance


They are various in shape, round, elliptical, square, and shaped. The diameter of the light source is generally 3-5mm, and it is also 8mm or even 10mm.


They can achieve monochromatic illumination, two-color illumination and multi-color illumination.

Monochrome illumination requires only two leadframes, and the current flows in and out.

Two-color illumination, in which two lead frames are connected to two colors of chips, for example, red and green colors. If only the red part is turned on, the emitted light is red, only the green part is turned on, and the emitted light is Green, the light that is both energized and mixed is yellow. The most common are the color changes of the charger after charging and after full charge.

The multi-color illuminating lamp beads are also called colorful beads. The principle is the same as the two-color illuminating, but the chips in the lamp bead are more and more colorful.

Pin-in (DIP) beads are rarely used for lighting, and are often used as lights, indicators (phones, lights, lights) and displays.


Low power surface mount type (SMD)

The low-power surface-mounted lamp bead is literally understood, that is, the package is attached to the surface of the board, and the front pin type needs to be inserted inside the board. They have the following characteristics:


Long life and small size

Low power consumption and shock resistance


Small power surface mount lamp beads, very many models, which are used more: 2835, 3528, 4014, 5740, 3014, 5050, these figures represent their size, such as 2835, it means 2.8mm long, It is 3.5mm wide and is usually the size of a mung bean.


High-power surface mount type (SMD)


Its essence is the same as that of the small power surface mount type (SMD), except that the chip is larger and the lamp bead is larger. Generally, the size of the soy bean is large, and a lens is often used for light distribution.


From the color of the package (that is, the color of the phosphor), the color temperature of the bead can be roughly judged. The upper left picture looks like the light emitted by the yellow is generally low color temperature, while the lower left picture shows the high color temperature when the green light is emitted, and the white color is usually the colored light.


Integrated package COB


Integrated package COB, which integrates many chips on a single package board. They are larger than the previous ones and have a pentagram size of 9mm, 13mm or even 19mm. The appearance is round, square, and long, which can achieve very high power.


Chip scale package CSP

Chip-level package CSP, a relatively new technology, the package method described above, the outer package will be much larger than the chip itself, and this new package, the package is often only a little larger than the chip, so its overall volume Smaller, the current lighting is rarely able to achieve mass production, mainly in the portable products such as mobile phone flash.


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