Hot Air BGA Rework Station
1.Automatic desoldering, Mounting and Soldering, automatic pick up chip when desoldering completed. 2.CE certification approved. Double protection (Overheating guard + emergency stop function.)
Hot Air BGA Rework Station
1.Application of Hot Air BGA Rework Station
Motherboard of computer, smart phone, laptop, MacBook logic board,digital camera ,air conditioner, TV and other electronic equipments from medical industry, communication industry, automobile industry, etc.
Suitable for different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.
2.Product Features of Hot Air BGA Rework Station
• Precise optical alignment system
CCD camera amplify up to 200x, with top/down light brightness adjust function, mounting accuracy is within 0.01 mm.
• Automatic desoldering, Mounting and Soldering, automatic pick up chip when desoldering completed.
•Comes With 5 Different Size Of Nozzles: Upper 31*31mm, 38*38mm, 41*41mm. Bottom 34*34mm, 55*55mm
•High Power Cross Flow Fan, Cools The Pcb Very Quickly, Preventing It From Deformation.
3.Specification of Hot Air BGA Rework Station
4.Details of Hot Air BGA Rework Station
5.Why Choose Our Hot Air BGA Rework Station?
6.Certificate of Hot Air BGA Rework Station
7.Packing & Shipment of Hot Air BGA Rework Station
What are the advantages of SMT package?
The so-called surface assembly technology refers to the components of the sheet structure or the miniaturized components suitable for surface assembly, placed on the surface of the printed board according to the requirements of the circuit, and assembled by welding processes such as reflow soldering or wave soldering. An assembly technique that constitutes a functional electronic component. The difference between the mounting method of SMT and THT components is shown in the figure. On a conventional THT printed circuit board, components and solder joints are located on both sides of the board; on the SMT board, solder joints and components are on the same side of the board. Therefore, on the printed circuit board of the SMT placement machine, the through holes are only used to connect the wires on both sides of the circuit board, the number of holes is much smaller, and the diameter of the holes is much smaller. In this way, the assembly density of the board can be greatly improved.
SMT surface mount components are functionally different from plug-in components, with the difference being the package of components. Surface mount packages are subjected to very high temperatures during soldering and their components and substrates must have a matching coefficient of thermal expansion. These factors must be considered in the product design.
The characteristics of SMT process technology can be compared with the difference between traditional through hole insertion technology (THT). From the perspective of assembly process technology, the fundamental difference between SMT and THT is “stick” and “plug”. The difference between the two is also reflected in the substrate, components, component form, solder joint morphology and assembly process methods.
Choosing the right chip processing package has the following advantages:
1. Effectively save PCB area;
2. Provide better electrical performance;
3. Protect the internal parts of the components from environmental influences such as moisture;
4. Provide good communication links;
5. Helps to dissipate heat and facilitate transmission and testing.
The selection and design of SMT surface mount components is a key part of the overall design of the product. The designer determines the electrical performance and function of the components in the system structure and detailed circuit design stage. In the SMT design phase, it should be based on the specific conditions of the equipment and process. The overall design requirements determine the package form and structure of the surface mount components.
Surface mount solder joints are both mechanical joints and electrical joints. Reasonable choices have a decisive influence on improving PCB design density, manufacturability, testability and reliability.