Phone Repair SMT BGA Rework Station DH-5860

Phone Repair SMT BGA Rework Station DH-5860

1 Piece Min. Order
Dimensions: 750*710*610mm
Gross Weight: 60KG
Rated Capacity: 4800W
Temperature Profile Storage: 50,000 groups
Voltage: AC 220V 50/60Hz (AC 110V optional)
Rated Duty Cycle: 100%

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Product Details

Dinghua DH-5860 SMD BGA Rework Station

This machine is for repairing motherboard IC/Chip/Chipset of Laptop, Mobile, PC, iPhone, Xbox, etcWith features 3-heater(2xHot air+IR Preheating), embedded Smart PC, Auto Profile, Cooling Fan, Micro hot-air adjustment, Vacuum Pick-up & Place, Universal Support for most of the PCB Size/Shape.


5860 01.png




SPECIFICATIONS

Total Power

4800W

Top heater Power

800W (1st Hot air heater)

Bottom Heater

1200W(2nd hot air heater), 2700W (IR preheat)

Temperature Accuracy

±2℃

Power Supply

AC 220V 50/60Hz (AC 110V optional)

Dimension

750x710x610mm (L*W*H)

Temperature Profile Storage

50,000 groups

Operation Mode

Manual+Touchscreen

PCB Support

V-groove + universal fixture + 5-points support + Adjustable in X direction

Temperature Control

K-type Thermocouple + Closed Loop + Auto compensation

PCB Size

Max.450x400mm, Min. 22x22mm

BGA Chip

2x2mm-80x80mm

Minimum Chip Spacing

0.15mm

External connector for temperature testing

1pcs or Customized

Net Weight

48KG





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