Mobile Phone BGA Hot Air Rework Station DH-5830

Mobile Phone BGA Hot Air Rework Station DH-5830

1 Piece Min. Order
Dimensions: 700*760*580mm
Gross Weight: 60KG
Rated Capacity: 4800W
Temperature Profile Storage: 50,000 groups
Voltage: AC220V±10% 50Hz
Operation Mode: Manual+Touchscreen

Send InquiryChat Now
Product Details

Dinghua DH-5830 BGA Rework Station

This machine is for repairing motherboard IC/Chip/Chipset of Laptop, Mobile, PC, iPhone, Xbox, etcWith features 3-heater(2xHot air+IR Preheating), embedded Smart PC, Auto Profile, Cooling Fan, Micro hot-air adjustment, Vacuum Pick-up & Place, Universal Support for most of the PCB Size/Shape.

Product  Application

Motherboard of computer,smartphone,laptop,digital camera ,air conditioner,TV and other electronic equipments from medical industry,communication industry,automobile industry,etc.

Wide range of application: BGA, PGA, POP,BQFP, QFN, SOT- 223, PLCC, TQFP, TDFN, TSOP, PBGA, CPGA, LED chip.



Total Power


Top heater Power

800W (1st Hot air heater)

Bottom Heater

1200W(2nd hot air heater), 2800W (IR preheat)

Temperature Accuracy


Power Supply

AC220V±10%     50Hz


700x760x580mm (L*W*H)

Temperature Profile Storage

50,000 groups

Operation Mode


PCB Support

V-groove + universal fixture + 5-points support + Adjustable in X direction

Temperature Control

K-type Thermocouple + Closed Loop 

PCB Size

Max.410x370mm, Min. 22x22mm

BGA Chip


Minimum Chip Spacing


External connector for temperature testing

1pcs or Customized

Net Weight


Contact  Information 

Scan the QR code to save the contact . 

Or click the link to send me messages on Whatsapp directly.

Hot Tags: Mobile Phone BGA Hot Air Rework Station DH-5830, China, suppliers, manufacturers, price, for sale
Related Products
    Contact Us
  • +86-0755-29091822
  • 4th Floor, Block 6B, Shengzuozhi Industrial Park, Xinyu Road, Shajin, Baoan, Shenzhen, China