Automatic Bga Rework Station

Automatic Bga Rework Station

1.User-friendly. 2.Touch screen control 3.3 independent heating areas. 4.3-year warranty for heating system

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Product Details

Automatic BGA Rework Station



1.Application of Automatic BGA Rework Station

Motherboard of computer, smart phone, laptop, MacBook logic board,digital camera ,air conditioner, TV and other electronic equipments from medical industry, communication industry, automobile industry, etc.

Suitable for different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.


2.Product Features of Automatic BGA Rework Station

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High Efficiency is the ultimate goal in our constant pursue of perfection. Possessing fine heating element with 1000W upper hot air injection and ultra large IR bottom heating system, DH-A2E offers excellent efficiency in soldering and desoldering performance. Versatile clamper is specially designed for various P.C.B. from mobile phone to server field.

 

Reliability of DH-A2E guarantees the quality and stable yield rate.  The use of New Fuzzy Industrial Microprocessor and Aviation Industrial Precision Linear Mechanism brings more accurate and reliable result.  Precise and clear Different Color Alignment System makes alignment trustworthy.

 

User-Friendly design with integrated operation interface brings working pleasure to operators.  No need for extra equipment or air-supply, AC power itself is sufficient.  Within 2 hours of training, operator could understand and operate our intuitive operation controller with ease for it is that user friendly.


3.Specification of Automatic BGA Rework Station

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4.Details of Automatic BGA Rework Station

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5.Why Choose Our Automatic BGA Rework Station? 

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6.Certificate of Automatic BGA Rework Station

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7.Packing & Shipment of Automatic BGA Rework Station

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8.Related knowledge of automatic BGA rework station.


BGA ball placement methods and techniques:


     First: BGA ball must ensure that the pad surface is flat. If it is not flat, the pad should be flattened. If your eyes are not visible, clean it with wash water and touch it with your hands. Basically, there is no burr. It's okay, and the pad must be bright so that it can be tinned. If the pad is gray and black, add flux and then pull the pad back and forth until it shines. After the pad is finished, it must be cleaned. .


    Second: This is one of the main points. Use a flat-headed small brush to gently apply a layer of solder paste on the BGA pad. The flux must be coated very much and very evenly. How can I see it? Under the fluorescent light, the traces of the oil should be evenly distributed, instead of one side and less, you should pay attention to this step. If it is not done, whether it is heating with steel mesh or without heating the steel mesh, it may cause problems, especially without steel mesh. Heating the flux is uneven, and a heated solder ball may be connected.


Pay attention to the points.


        Steel mesh: It must be cleaned, and the steel mesh should not be deformed. If the deformation is corrected by hand, the deformation is too serious and a steel mesh is replaced.


        Selection of solder balls: now on the market, the solder balls have 0.2mm 0.25mm 0.3mm 0.35mm 0.4mm 0.45mm 0.5mm 0.6mm 0.76


When choosing, be sure to choose clean, the size of the solder ball is uniform, and distinguish the lead-free solder ball with lead, because the temperature of the tin will be different.


    Third: put the chip on the base of the ball-handling platform, then pour the stencil on the flat surface of the steel mesh into the appropriate tin ball, gently shake the steel mesh to make a good solder ball in each hole, and then take the steel mesh go. Then use the camera to clip the solder ball to the heating table. (When melting a tin ball, pay attention to distinguish between lead and lead-free temperatures. If lead is generally used with 190 degrees lead-free 240 degrees), when heating BGA, the material under the BGA should be selected from small heat-conducting materials, such as high temperature. Cloth, etc., so that heating the BGA solder ball will become very fast, and conversely, the solder ball will not damage the chip for a long time.


    Fourth: When is it better to heat up? The color of the solder ball will become gray when it melts, and then it will be bright and liquid, so it is good! Therefore, when heating, there should be a place with good light, preferably under the fluorescent lamp, so that it is clearer (note: the middle of the BGA is generally slower than the surrounding heat, so we of course see the middle of the tin ball gray and then brighten In order to stop heating), but this method is difficult for novices, BGA does not make the eyes less easy to distinguish, do not worry, there is another way is to use the tip of the tweezers to gently touch the process of heating, BGA middle The solder ball will be deformed into a liquid form if it is changed. If it is not, it will be displaced if it is touched. However, be careful when doing this action. If it is difficult to melt the tin because the chip is too thick, you can use a heat gun to heat it at a fixed height, but also keep spinning. Don't stare at a point, then the tin ball in the middle of the BGA will light up and stop heating immediately. Let it cool naturally, so it will succeed!





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