Reflow Touch Screen BGA Rework Machine
1. Automatic soldering,de-soldering and mounting BGA IC chip
2. Optical CCD camera lens:90°open/folding, HD 1080P
3. Camera magnification: 1x - 220x
4. Placement accuracy: ±0.01mm
Reflow Touch Screen BGA Rework Machine
1.Application of Reflow Touch Screen BGA Rework Machine
Motherboard of computer, smart phone, laptop, MacBook logic board,digital camera ,air conditioner, TV and other electronic equipments from medical industry, communication industry, automobile industry, etc.
Suitable for different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.
2.Product Features of Reflow Touch Screen BGA Rework Machine
• Widely used in Chip Level Repairing in mobile phone, small control boards or tiny motherboards etc.
• Desoldering, mounting and soldering automatically.
• HD CCD Optical Alignment system for precisely mounting BGA and Components
• Movable universal fixture prevent pcb from damaged on fringe component, suitable for all kinds of pcb repairing.
• High power LED light to ensure brightness for working, and different size of magnet nozzles, titanium alloy material, easy replace and install, never deformation and rusty.
3.Specification of Reflow Touch Screen BGA Rework Machine
4.Details of Reflow Touch Screen BGA Rework Machine
1.CCD camera( precise optical alignment system) ;
2.HD digital display ;
3. Micrometer (adjust angle of chip) ;
4.Hot air heating；
5. HD touch screen interface ， PLC control ;
6.Led headlamp ;
7.Joystick control .
5.Why Choose Our Reflow Touch Screen BGA Rework Machine?
6.Certificate of Reflow Touch Screen BGA Rework Machine
7.Packing & Shipment of Reflow Touch Screen BGA Rework Machine
BGA chip rework operation process guidelines
First, the BGA chip repair process guidelines
This article mainly describes the “BGA” IC de-soldering, ball-planting operation procedures and matters needing attention in the maintenance process for leaded and lead-free boards on the BGA rework station.
Second, BGA chip repair process description
Keep in mind the following issues in BGA maintenance:
1 To prevent over-temperature damage during the de-soldering process, the temperature of the hot-air gun must be adjusted in advance during de-soldering. The required temperature is (280~320°C), and the temperature is not allowed to be adjusted during de-soldering.
2 Prevent static electricity from being damaged. Wear an electrostatic wrist strap before handling.
3 to prevent the demolition of the hot air gun wind and pressure damage, desoldering should be adjusted in advance of the hot air gun pressure and pressure, mobilization of wind and pressure when dismantling welding is prohibited.
4 To prevent the BGA pads on the PCBA from being damaged. During the de-bonding process, you can touch the BGA with a tweezers to confirm whether the solder melts. If the solder can be removed, the unmelted solder must be heated to the molten solder. Note: During the operation, touch it gently and do not use force.
5 Note the positioning and orientation of the BGA on the PCBA to prevent secondary solder ball soldering.
Third, basic equipment and tools to be used in BGA maintenance
The basic equipment and tools are as follows:
1 Intelligent hot air gun. (used to remove BGA)
2 Anti-static maintenance desk and electrostatic bracelet. (Before the operation, you must wear an electrostatic wristband and operate in an antistatic maintenance station)
3 anti-static cleaner. (for BGA cleaning)
4 BGA rework station. (used for BGA welding)
5 High temperature box (for PCBA board baking)
Auxiliary equipment: vacuum suction pen, magnifying glass (microscope)
Fourth, pre-board baking preparation and related requirements
1 According to the different exposure time, the board will be given different baking requirements, the board exposure time: based on the processing month on the board bar code, and so on.
2 Baking time, baking as follows:
Exposure time ≤ 2 months 2 months or more
Baking time 10 hours 20 hours
Baking temperature 105±5°C 105±5°C
3 Before the baking plate, the maintenance personnel should remove the temperature-sensitive components and bake it, such as optical fiber, plastics, etc. Otherwise, the device will be damaged by heat. 4 On all boards, the BGA rework must be completed within 10 hours after the board is completely removed after baking.
5 PCBA that can not complete the BGA rework operation within 10 hours must be stored in the drying oven, otherwise it will easily lead to moisture regain. When the reheated PCBA is added to the PCBA, it will easily cause the PCBA to kick.
Five, BGA chip unsoldering and ball planting steps
1, BGA preparation before welding
The parameter state of the hot air gun is set to: the temperature is 280°C~320°C; the welding time is 35-55 seconds; the wind parameter is: 6 files; finally, the PCBA is placed on the antistatic table and fixed.
2, solution welding BGA
Please remember the direction and positioning of the chip before unwinding. If there is no silk screen or frame on the PCBA, use a marker to draw a small area around the bottom of the BGA, and inject a small amount of flux at the bottom or side of the BGA. Select the appropriate BGA size BGA special welding nozzle. On the hot air gun, the handle is vertically aligned with the BGA, but note that the nozzle must leave the unit about 4mm, start the hot air gun, the hot air gun will automatically desolder with preset parameters, after the desoldering is completed, use a suction pen after 2 seconds After the BGA component is disassembled and the device is dismantled, it must be checked whether the pad of the removed device has a pad dropped, whether the circuit is scratched or detached, damaged, etc. If there is any abnormality, timely feedback processing.
3, BGA and PCB cleaning
1 Place the board on the workbench and use the soldering iron and the soldering wire to suck away the excess residual tin on the pad. Level the pad. When cleaning, place the soldering wire on the pad. Lift the soldering wire up with one hand. Put the soldering iron on the soldering wire, lightly press the soldering iron to melt the residual solder on the PCBA or BGA pad and adsorb it on the soldering wire. Then move the soldering wire to other positions to absorb the rest of the solder. : Cannot pull on the pad to avoid damaging the pad.
2 After the pad is cleaned, use PCB water to clean the PCBA pad (with a rag). If the CPU needs to be re-ballooned, use an ultrasonic cleaner (with antistatic device) to load the paddle. The BGA removed will be cleaned and re-ball welded.
Note: For lead-free device pad cleaning, soldering iron temperature requirements <actual value> 340 +/- 40 °C; for CBGA, CCGA pad cleaning, soldering iron temperature requirements <actual value> 370 +/- 30 °C;. Remarks: There is a certain difference in each soldering iron (if the soldering temperature is not enough), please put forward, and the responsible person will make adjustment according to the actual situation. If no adjustment is made, it must be strictly implemented according to the above requirements.
4, BGA chip ball
The tin of BGA chip must be made of laser-punched steel sheet with single-sided flared mesh. The thickness of steel sheet is required to be 2mm thick, and the wall of the hole is required to be smooth and tidy. The underside of the horn hole (a face that touches the BGA) should be The above (scratch tin holes) 10μm ~ 15μm. (The above two points can be observed by ten times the magnifying glass). Use the above-mentioned BGA service station tinning function → template and steel sheet, first find the corresponding concave position in the positioning template, fix the BGA in the positioning template, place the steel sheet with precise positioning square and round hole into the positioning template On top of it, the steel sheet is pressed against the stencil with its attachment magnetic force block. The tool has three precise positioning devices (BGA → template → steel sheet), which can conveniently and accurately align the steel mesh holes to the small pads of the BGA component (but remember that the steel is engraved with the word up). A small scraper is used to scrape a small amount of thicker solder paste into the mesh of the steel sheet. When all the meshes are full, the steel sheet is slowly lifted from one end of the steel sheet. The BGA chip is printed on the screen. A small tin pile was made and heated again with a hot air gun, so that the BGA on the tin pile became a uniform array of tin balls. If there are no solder balls on the individual pads, the steel can be pressed again for partial soldering. Can not be heated together with the steel sheet, because in addition to the impact of planting tin ball, but also the precision of the steel sheet heat deformation and damage.
5, BGA chip welding
A small amount of thicker flux was applied to the BGA solder balls and PCBA pads, and the original mark was placed to place the BGA. During welding, the BGA should be bonded and positioned to prevent it from being blown away by hot air, but care must be taken not to put too much flux. Otherwise, it will generate excessive bubbles due to rosin and cause the chip to shift. The PCBA board is also placed in the BGA Rework Station and must be placed horizontally. Replace the appropriate nozzle. The nozzle is aligned with the BGA chip and left 4mm. Select the BGA Rework Station preselected temperature profile and click on the screen to automatically solder. ( Note: The BGA cannot be pressed during the welding process, which may easily lead to a short circuit between the balls.) Soldering with the PCBA pad as the BGA solder ball melts, and the surface tension of the solder ball allows the chip to remain on the motherboard The deviation will also be automatically centered, so that the BGA rework station is heated and the BGA welding operation is completed. But note that when the BGA rework station finishes heating, it will sound an alarm. Do not move the BGA rework station and PCBA board at this time. Because the BGA rework station and PCBA board are in a high temperature and not solidified state, wait 40 seconds before BGA rework station and PCBA. Can be removed after cooling.
Six, BGA welding inspection and PCBA board cleaning
1. The BGA component and PCBA should be cleaned after the welding is completed, and the plate cleaner should be used to clean the surface of the BGA component and remove any excess flux and tin particles that may appear.
2. Check the BGA components that have been soldered with the PCB using the magnifier lamp, which is mainly whether the chip is centered, whether the angle corresponds, whether it is parallel with the PCBA, whether there is solder overflow from the periphery, or even a short circuit, if any of the above occurs. The re-soldered ball must be re-soldered and must not be rushed to the test machine, so as not to expand the scope of the fault, and only when the inspection is correct, the power can be checked to check the machine performance and function.