Preheating Touch Screen BGA Rework Machine

It is also ideal for replacing small components on smartphones without damaging nearby connectors and other plastic parts.

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Product Details

Preheating Touch Screen BGA Rework Machine

 

1. Product Features of Preheating Touch Screen BGA Rework Machine


preheating touch screen bga rework machine.jpg


1. Top & bottom temperature areas heat independently, A cross-flow fan cools rapidly to protect the PCB from deformation when welding.

2. For large thermal capacity of PCB or other high-temperature and lead-free welding requirements, all can be handled easily.

3. Pre-Heater monitoring prevents an operator from beginning a profile when the heater is not ready.

4. Pre-Heater can be turned off or put into SetBack when system is not being used.

Vacuum pik has built in theta adjustment for easy positioning of components.

5. After BGA remove and solder  have voice alarm function.


3.Specification of Preheating Touch Screen BGA Rework Machine


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4.Details of Preheating Touch Screen BGA Rework Machine

1. HD Touch screen interface;  

2.Three independent heaters ( hot air & infrared ) ;

3. Vacuum pen; 

4.Led headlamp.



5.Why Choose Our Preheating Touch Screen BGA Rework Machine? 



6.Certificate of Preheating Touch Screen BGA Rework Machine


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7.Packing & Shipment of Preheating Touch Screen BGA Rework Machine



8.Related knowledge

Double-sided mixed process of SMT

A: incoming inspection => PCB's B-side patch glue => patch => curing => flap => A-side PCB plug => wave soldering => cleaning => test => rework

Post-paste first, suitable for SMD components more than discrete components

B: incoming inspection => PCB A-side insert (pinning) => flap => PCB B-side spot adhesive => patch => curing => flap => wave soldering => cleaning => Test => Rework Post-insertion and post-fitting, suitable for separating more components than SMD components

C: incoming material inspection => PCB's A surface silk screen solder paste => patch =>

drying => reflow soldering => plug-in, pin bending => flap => PCB B surface patch glue => Patch => Curing => Flap => Wave Soldering => Cleaning => Detection => Rework A surface mixed, B surface mount. ?

D: incoming inspection => PCB's B side spot adhesive => patch => curing => flap => PCB's A side silk screened solder paste => patch => A side reflow => plug-in => B-side wave soldering => cleaning => test => rework A-side mixing, B-side mounting. First SMD, reflow, post-fabrication, wave soldering

E: incoming inspection => PCB side B silk screen solder paste (point mount glue) => patch => drying (curing) => reflow soldering => flap => PCB side A silk screen solder paste => Patch => Drying = Reflow soldering 1 (local soldering can be used) => Plug-in => Wave soldering 2 (If there are few components, you can use manual soldering) => Cleaning => Test => Rework A surface mount, B face mixed.

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