IR Touch Screen BGA Rework Machine

IR touch screen bga rework machine Quick preview: DH-A1L SMD REWORK MACHINE is eqiupped with laser positioning function, can quickly Position on BGA Chip and motherboard.If you are looking for a bga rework station for mobile phone repairing, congratulation! You’ve find the original factory....

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Product Details

IR touch screen bga rework machine

Quick preview:

DH-A1L SMD REWORK MACHINE is eqiupped with laser positioning function, can quickly Position on BGA Chip and motherboard.If you are looking for a bga rework station for mobile phone repairing, congratulation! You’ve find the original factory. Dinghua, may be the best brand of bga rework station around the world.


1. Specification






Top heater

Hot air 800W


Bottom heater

Iron heater

Hot air 1200W, Infrared 2800W



Power supply







V-groove, PCB support can be adjusted in any direction with external universal fixture


Temperature control

K type thermocouple, closed loop control, independent heating


Temp accuracy

±2 degrees


PCB size

Max 500*400 mm Min 22*22 mm


BGA chip



Minimum chip spacing



External Temperature Sensor



Net weight


2.Application of the DH-A1L BGA rework station

Application Use for BGA Rework Stations

BGA rework stations have several different applications in the world of PCB repair and alteration. Here are a few of the most common applications.

Upgrades: Upgrades are one of the most common reasons for rework. Technicians may need to swap out parts or add upgraded pieces to a PCB.

Faulty parts: PCBs can have various faulty parts that may require rework. For example, pads could get damaged during BGA removal, any number of parts could be heat-damaged or there could be too much solder joint voiding.

Faulty assembly: A range of mistakes can occur during the rework process. For example, the PCB may have incorrect BGA orientation or a poorly developed BGA rework thermal profile. If this is the case, the PCB will likely need to undergo further rework to address the faulty assembly.

IC reason.jpg

3.Why you should choose DH-A1L BGA rework station?

A1L bga rework station advantages.jpg

4. Related Knowledge:

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.


Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.

5.Detailed Images of DH-A1L BGA REWORK STATION


6.Packing & delivery details of DH-A1L BGA REWORK STATION




Delivery detials of DH-A1L BGA REWORK STATION


1.Shipment will be done within 5 business days after receiving payment.

2.Fast delivery shipment by DHL,FedEX,TNT ,UPS and other ways including by sea or by air.




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9. Notes

As we all know by now, the Playstation 3 (PS3) can suffer from the dreaded Yellow Light of Death (YLOD) and the Xbox 360 can be inflicted with the issue called the Red Ring of Death (RROD). This occurs due to a manufacturer's defect when creating the board and not accounting for the vast amounts of heat generated while playing with the system for long periods of time.

Due to heat stressing the GPU (Graphics chip that controls all the fancy visuals in your game), the solder that forms a connection between the chip and the board eventually break. With this break, your system will throw that dreaded Blinking Light of Death error.Reball Method Repair - A reball repair is the same procedure as the reflow, but with a few more steps involved. Instead of just heating the chip and letting the solder underneath melt, the chip is heated to the point where it can be taken off the board.

Now when the chip is removed, there is about 200+ tiny solder points that have to be cleaned off with a soldering iron. Oh, and not to mention that you must clean the board as it also contains 200+ solder points left over from the residue. After all that is cleaned, you have to now align 200+ tiny solder balls onto the chip with a special stencil and mount. Saying it is easy, but doing it is not. This alone is the most annoying and time consuming part of a reball as you pour mass amounts of balls onto a stencil in hopes that each of those 200+ balls are seated properly on the chip.  After doing that, you have to remove the stencil and there will always be a few balls being knocked out of place that you have to look for. 

Once that is done, the chip alone has to be heated to the point where the 200+ balls melt onto the chip and stay there. After that you wait for it to cool. Then, you place it back onto the board and reheat that to melt the chip onto the motherboard. And now you have a reballed system! Sometimes it could be very frustrating if even one ball was misaligned.

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