Manual Optical BGA Rework Machine

Manual optical bga rework machine 1. Quick preview: We supply DH-G600 with better performance. If you are looking for a bga rework station for mobile phone repairing, congratulation! You’ve find the original factory -- Dinghua Tech. Our factory may be the best one of BGA rework station mfg.We...

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Product Details

Manual optical bga rework machine

1. Quick preview:

We supply DH-G600 with better performance.

If you are looking for a bga rework station for mobile phone repairing, congratulation! You’ve find the original factory -- Dinghua Tech. Our factory may be the best one of BGA rework station mfg.We are expecting become your long team partner in China.


Product parameter

Product name

soldering and desoldering machine

Total power

5300W

top heating

1200w

bottom heating

bottom hot air heating 1200W, IR preheating 2700W

Power

220V 50HZ/60HZ

Positioning

V-groove, PCB boards can be adjusted in X, Y axis and equipped with universal fixture

Temperature control

K-type, Closed loop

PCB size

Max 400x380mm, Min 22x22mm

Chip size

2x2-50x50mm

Minimum chip spacing

0.15mm

External temperature sensor

1(optional)

N.W.

approx 60kg

Suitable   motherboards

mobile phone, laptop, desktop, game console, XBOX360, PS3


3. Product Features and application of the DH-G600 BGA rework station

Main Features

1). Imported heater, high quality, durable.

2). Taiwan infrared pre-heating ceramic plate, glass guard.

3). Adopt two heating zone, upper heater is infrared heating, lower heater is infrared preheat zone.

4). K type close loop control, the temperature accuracy will be on ±2°C

5). With outer sensor connector, detech actual temperature when heating.

6). High power cross flow cooling fan, prevent the PCB from deformation.

7). Sound hint system: there is voice reminder 5s-10s before the completion of heating,to get the operator prepared.

8). Security measure: overheat guard and emergency stop function

 

DH-G600 BGA Rework Station APPLICATION:

Apply to electronic assembly and manufacture in reworking and maintaining operation.

High stability PCB, SMD components remove/mount, reflow station.

Remove/mount the components of PBGA, UBGA, CSP, PLCC, QFP, SOJ, MSP, SOP, etc.

Suitable for large size of PCB.

⇒  Laptop / Notebook/ Computer  motherboard repair. 

⇒  Playstation / XBOX 360 and other game console repair.

⇒  Iphone 4/ 4s / 5 / 5s motherboard repair.

⇒  TV / Video / ipad mainboard repair.

⇒  SMD/  SMT / IC  BGA rework


Why choose DH-G600 BGA rework Station?

One of the best advantages of DH-G600 BGA rework Station is that it is suitable with all kinds of IC, including but not limited to BGA, PGA, POP, BQFP, QFN and so on. Buying one machine can meet all your damands of IC repairing and BGA replacement.


G600 bga rework station  APPLICATION IC.jpg

 

4.Detailed Images of G600 BGA REWORK STATION



4. Company Profile

Some pictures of our factory and BGA rework station

Offices


office.jpg


Manufacturing lines


G600 bga rework station  manufacturing lines.jpg


5.CE Certification as below


CE.jpg

 

Part of our Clients


hornored clients.jpg


6. Packing & Delivery & Services of G600 BGA REWORK STATION



 

 

7. Related knowledge

Reball Method Repair - A reball repair is the same procedure as the reflow, but with a few more steps involved. Instead of just heating the chip and letting the solder underneath melt, the chip is heated to the point where it can be taken off the board. Now when the chip is removed, there is about 200+ tiny solder points that have to be cleaned off with a soldering iron. Oh, and not to mention that you must clean the board as it also contains 200+ solder points left over from the residue. After all that is cleaned, you have to now align 200+ tiny solder balls onto the chip with a special stencil and mount. Saying it is easy, but doing it is not. This alone is the most annoying and time consuming part of a reball as you pour mass amounts of balls onto a stencil in hopes that each of those 200+ balls are seated properly on the chip.  After doing that, you have to remove the stencil and there will always be a few balls being knocked out of place that you have to look for.  Once that is done, the chip alone has to be heated to the point where the 200+ balls melt onto the chip and stay there. After that you wait for it to cool. Then, you place it back onto the board and reheat that to melt the chip onto the motherboard. And now you have a reballed system! Sometimes it could be very frustrating if even one ball was misaligned.

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