Automatic BGA IC Chips Remove Machine

Automatic BGA IC Chips Remove Machine

BGA rework stations are used for soldering and desoldering of unit parts on the Printed Circuit Boards (PCBs). Unit parts are normally clustered in a very small section of a PCB and will require heating of the board in that particular area. To handle such critical and sensitive work/rework where there is a chance of parts getting damaged our BGA rework stations like DH-A2E.

Send InquiryChat Now
Product Details

Automatic BGA IC Chips Remove Machine


1.Application of Automatic BGA IC Chips Remove Machine

Motherboard of computer, smart phone, laptop, MacBook logic board,digital camera ,air conditioner, TV and other electronic equipments from medical industry, communication industry, automobile industry, etc.

Suitable for different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.


2.Product Features of Automatic BGA IC Chips Remove Machine

selective soldering machine.jpg


• Highly efficient, long-life 400 W hybrid heating head

• Optional with 800 W IR-bottom heating

• Very short soldering times feasibel

• Activation with safety foot switch

• Operation LEDs on the system

• Intuitive operation without software 


3.Specification of Automatic BGA IC Chips Remove Machine

bga desoldering machine.jpg


4.Details of Automatic BGA IC Chips Remove Machine

led soldering machine.jpglaser soldering machine price.jpgautomatic soldering machine.jpg


5.Why Choose Our Automatic BGA IC Chips Remove Machine? 

mini wave soldering machine.jpgsoldering machine price.jpg


6.Certificate of Automatic BGA IC Chips Remove Machine

usb soldering machine.jpg


7.Packing & Shipment of Automatic BGA IC Chips Remove Machine

bga chip desoldering and soldering machine.jpgoptical playstation bga rework station.jpg


8.Related knowledge


What is board soldering?


Circuit board, circuit board, PCB board, pcb soldering technology In recent years, the development history of the electronics industry, it can be noted that a very obvious trend is reflow soldering technology. In principle, conventional inserts can also be reflow soldered, which is commonly referred to as through-hole reflow soldering. The advantage is that it is possible to complete all solder joints at the same time, minimizing production costs. However, temperature sensitive components limit the application of reflow soldering, whether it is a plug-in or SMD. Then people turn their attention to selective soldering. In most applications, selective soldering can be used after reflow soldering. This will be the economical and efficient way to complete the soldering of the remaining inserts and is fully compatible with future lead-free soldering.


       Circuit board, circuit board, PCB board, pcb soldering technology In recent years, the development history of the electronics industry, it can be noted that a very obvious trend is reflow soldering technology. In principle, conventional inserts can also be reflow soldered, which is commonly referred to as through-hole reflow soldering. The advantage is that it is possible to complete all solder joints at the same time, minimizing production costs. However, temperature sensitive components limit the application of reflow soldering, whether it is a plug-in or SMD. Then people turn their attention to selective soldering. In most applications, selective soldering can be used after reflow soldering. This will be the economical and efficient way to complete the soldering of the remaining inserts and is fully compatible with future lead-free soldering.


The characteristics of the selective soldering process can be compared to the wave soldering to understand the process characteristics of selective soldering. The most obvious difference between the two is that the lower portion of the PCB in the wave soldering is completely immersed in the liquid solder, while in selective soldering, only certain areas are in contact with the solder wave. Since the PCB itself is a poor heat transfer medium, it does not heat the solder joints that melt adjacent components and PCB areas during soldering. The flux must also be pre-coated before soldering. Compared to wave soldering, flux is only applied to the part of the PCB to be soldered, not the entire PCB. In addition, selective soldering is only suitable for soldering of the interposing components. Selective soldering is a completely new approach, and a thorough understanding of selective soldering processes and equipment is necessary for successful soldering.


Selective Soldering Processes Typical selective soldering processes include: flux coating, PCB preheating, dip soldering, and drag soldering.


Flux Coating Process In the selective soldering process, the flux coating process plays an important role. At the end of solder heating and soldering, the flux should be sufficiently active to prevent bridging and prevent oxidation of the PCB. The flux is sprayed by the X/Y robot carrying the PCB through the flux nozzle and the flux is sprayed onto the PCB to be soldered. Fluxes are available in single-nozzle spray, micro-hole spray, and simultaneous multi-point/pattern spray. The microwave peak after the reflow soldering process, the most important thing is the accurate spraying of the flux. The micro-hole spray type will never contaminate the area outside the solder joint. The minimum solder dot pattern diameter of micro-spraying is greater than 2mm, so the positional accuracy of the solder deposited on the PCB is ±0.5mm, so as to ensure that the flux always covers the soldered part. The tolerance of the spray soldering dose is provided by the supplier. The flux usage is specified and a 100% safety tolerance range is usually recommended.


The main purpose of the preheating process in the selective soldering process is not to reduce the thermal stress, but to remove the solvent pre-drying flux, so that the flux has the correct viscosity before entering the solder wave. During soldering, the effect of preheating heat on solder quality is not a critical factor. PCB material thickness, device package size, and flux type determine the preheat temperature setting. In selective soldering, there are different theoretical explanations for preheating: Some process engineers believe that the PCB should be preheated before the flux is sprayed; another point of view is that soldering is not required without preheating. The user can arrange the selective soldering process according to the specific situation.



Hot Tags: automatic bga ic chips remove machine, China, suppliers, manufacturers, price, for sale
Related Products
Inquiry
    Contact Us
  • +86-0755-29091822
  • Sales31@dinghua-bga.com
  • 4th Floor, Block 6B, Shengzuozhi Industrial Park, Xinyu Road, Shajin, Baoan, Shenzhen, China
    JOIN US