Infrared Touch Screen Bga Reballing Station
Infrared touch screen BGA reballing station The BGA rework station DH-B2 with multiple features, such as Top air flow, blue-tooth speaker, carbon fiber heating tubes, glass-shield and double shadowless lights etc. Very popular for those people who work on personal repair shop, personal repair...
Infrared touch screen BGA reballing station
The BGA rework station DH-B2 with multiple features, such as Top air flow, blue-tooth speaker, carbon fiber heating tubes, glass-shield and double shadowless lights etc. Very popular for those people who work on personal repair shop, personal repair hobby and individual workshop etc.
The product parameters of infrared touch screen BGA reballing station
The 2nd area: 1200W(HR)， the 3rd 2700W（IR :large preheating area for almost all of PCB/MB）
Top air flow adjusting
For micro chip repaired
Can connect any cellphone for music/broadcast listening
IR preheating area
Carbon fiber heating tubes and glass-shield
“V” groove, PCB tables adjusting its in X direction, and jig/fixtures
K Sensor Closed loop
Max 500×400 mm, Min 22×22 mm
Minimum chip spacing
External Temperature Sensor
The product details of infrared touch screen BGA reballing station
Double shadowless lights, imported from Taiwan region, 5W as per one, bright and focusing on PCB/MB, no matter where you are standing, there is no shadow on PCN, so that the components can be observing clearly.
4 temp sensor ( thermocouple ), for real-time temperature tested if needed, 4 ones can be tested at same time so that technician can calibrate relevant temperate if any offset.
Top air flow adjusting, there is 10-class for your adjusting, usually , for the chip size more than 20*20mm, you can switch it to 5-class or more , on the other hand, it will be switched to less than 10-class, such as, if the chip is 10*10mm, it will be rotated to 5-class.
Spring than installed on working bench, when PCB/MB is being heated, it will work for PCB protected , so make the PCB best protection.
Blue-tooth speaker, which can connect any mobile phone for music enjoying or broadcast listening etc. Working while listening for much better and higher successful rework rate.
Carbon fiber heating tubes and covered by glass-shield which can prevent any small components or dust from dropping inside, and the red light of tubes is easy to be absorbed by PCB and longer&stable using life.
Also, there are 4 switches for the relevant tubes respectively, if smaller PCB repaired, 1 or 2 of them can be turned off for saving power and less so that there is less greenhouse gases on the earth.
The product quality of infrared touch screen BGA reballing station.
All of products have CE passed, and awarded High-tech industry qualification certificate, Independent intellectual property certificate and Tax certificate by our central office or regional department.
Factory outside located in where it is closed to mountain with fresh air, and not far away from subway station(5 minutes taking car) and bus station(5 minutes on feet), convenient for customers visiting.
This is part of our factory for BGA rework station, have others for screw locking machine, soldering station and glue dispensing machine etc.
FAQ: of this machine DH-B2 infrared touch screen BGA reballing station
1. Q: Can I design(change) a little something on the machine?
A: Usually, It’s OK, but if massive quantity, that would be cost-effective.
2. Q:What are the steps of BGA repair?
A: First, remove the components;Next, remove the residual solder.Once you have removed all the excess solder After the excess solder has been removed and the BGA has been reballed, finally, soldering.
3. Q: What does your factory rank in China?
A: We are the number one in this industry in China.
4. Q: Can you accept OEM? If yes, how many is the minimum quantity?
A: Yes, it depends on when you are going to purchase. Usually more than
Know-how about BGA rework station using:
The temperature set in the temperature setting of our machine refers to the air temperature of the tuyere when the heating is started. The air temperature blows on the surface of the bga chip and then conducts the heat to the solder ball. The temperature received by the solder ball will be due to the size and thickness of the bga chip. Depending on the material, material, and thermal conductivity, we need to use the temperature measurement line on the machine to measure the temperature of the solder ball during heating (the temperature in the above graph is also the measured solder ball temperature). Column (Figure 1) We can see the results of the test and then compare the properties of tin in (Table 1) to determine whether the welding requirements have been met. If it does not meet the requirements then I will change by changing the set temperature.
How to debug changes?
The general rework curve is divided into: preheating, heating, constant temperature, fusion welding, reflow welding five stages, the following describes how to adjust the test to curve unqualified, generally we divide the curve into three parts. The preheating and heating sections are one part. The function of this part is to reduce PCB's temperature difference, remove moisture, prevent blistering, and prevent thermal damage. The general temperature requirement is: When the second stage of operation is over, we test the temperature of tin. In the case of (lead-free: 160-175°C, lead: 145-160°C), if it is too high, it means that we set the temperature of the warm-up section to be too high, which can reduce the temperature of the warm-up section or shorten the time.
If it is low, you can increase the temperature in the warm-up section and the warm-up section or increase it. If it is stored for a long time, the unbaked pcb board can extend the first preheating time to bake the board to remove moisture. The constant-temperature section is a part. Generally, the temperature setting of our constant-temperature section is lower than that of the warm-up section. The purpose of this is to maintain the temperature inside the solder ball slowly up to a constant temperature. The function of this part is to activate the flux, remove the oxides and surface films on the surface of the metal to be welded and the volatiles of the flux itself, enhance the wetting effect, and reduce the effect of temperature difference. The temperature of the test tin in the general constant-temperature section is required to be (lead-free: 170-185°C, lead: 145-160°C). If the temperature is too high, the temperature at the constant temperature can be lowered. If the temperature is too low, the temperature at the constant temperature can be increased.
If the preheating time is analyzed to be too long or too short at the temperature measured by us, it can be adjusted by lengthening or shortening the time of the constant temperature period. The fusion welding and reflow soldering are one part. This part is to make the solder ball and pcb pad blend well. In this part we mainly need to achieve the soldering peak (Pb-free: 235~245°C lead: 210~220°C ) If the measured temperature is too high, you can reduce the temperature of the melt section or shorten the time of the melt section. If the measured temperature is low, you can increase the temperature of the melt section or lengthen the time of the melt section. The time for the common bga chip melt section is limited to 100 seconds, which means that we add time when the temperature is low. When the temperature is over 100 seconds or low, we choose to increase the temperature of the fusion section. Normal computer maintenance is necessary because The board and the chip will be somewhat moist without moisture. We give a safe upper maximum temperature reference (leaded 210°C, lead-free 230°C). General non-baked boards and chips To be on the safe side, set the maximum temperature not to exceed this temperature.
Figure 2 shows the temperature measurement method for us. The measured temperature of the solder ball inserted between the bga chip and pcb is the measured temperature mentioned above. Add welding: In general, we will choose to add welding in many cases. Before adding welding, we must add some flux or flux paste in the chip (you can use the air gun to blow the paste into the inside of the bga chip). Welding is the temperature we can not measure, then the experience is generally we use the naked eye to observe the change of the solder ball as a reference, generally to the fusion section is to observe the melting of the ball (lightening) after the residence time is (lead-free over 20 After 30s, there is lead after 10~20s). After stopping heating, some customers will choose to touch the bga chip with tweezers. If the chip is active and able to return to indicate that the ball has melted, then the residence time is (lead free 10~15s, after 5~10s of lead), stop heating. This must pay attention to touch bga chip strength can not be too large.