3 Heating Zones Touch Screen Bga Reballing Station
3 heating zones touch screen bga reballing station The purpose of BGA rework station is to desolder, mount and solder BGA chip of laptop, xbox360, computer motherboard, ps3, etc. DH-5830 is very popular machine around the world, as its elegant appearance , affordable price and simple operation...
3 heating zones touch screen bga reballing station
The purpose of BGA rework station is to desolder, mount and solder BGA chip of laptop, xbox360, computer motherboard, ps3, etc.
DH-5830 is very popular machine around the world, as its elegant appearance , affordable price and simple operation interface, especially for those personal repairing shop, regional distributors and amateurs etc.
Usually, BGA Rework stations are with two models:
1. Basic model(manual), it is composed of hot air and infrared heaters, totally 2 heating areas or 3 heating areas, top and bottom hot air heaters(some of them have no bottom hot air heater) and 3rd infrared heater.
2. High-end(automatic), with optical alignment vision system(optical CCD camera and monitor screen), featuring with clearly observe all the BGA chip point, and make BGA chip match with motherboard precisely on monitor screen for soldering.
The product parameter of 3 heating zones touch screen bga reballing station
2nd 1200W, 3rd IR heater 2800W
Taiwan led working light, any angle adjusted.
HD touch screen, intelligent conversational interface, digital system setting
Top heater movement
Right/left, frontward/backward, rotate freely.
Intelligent positioning, PCB can be adjusted in X, Y direction with "5 points support" + V-groov PCB bracket + universal fixtures.
Air switch (which can make machine and human being protected)
K sensor, close loop
Max 390×410 mm Min 22×22 mm
2x2 - 80x80 mm
Minimum chip spacing
External temper sensor
The product details of 3 heating zones touch screen BGA reballing station
Two pairs of knobs for the top head moved, helpful and easily. Ahead pair of knob for top head moved up or down when soldering or desoldering , the rear pair of knobs for top for top head move rearward or forward for a proper position to solder.
“7” word shape, which can let the top head move leftward/ rightward or fixed.
Large IR preheating area (up to 370*420mm), most of PCB can be preheated by it, such as , computer, top set box and iPad etc. Power about 2800W, suited for 110~240V.
BGA rework station’s operation interface, simple and easily operation, one LED light switch, one thermocouple port and one “start”, when all of parameters are set in the touch screen , click ”srart” to start soldering or desoldering.
About our factory
Our factory for BGA rework station, Auto screw locking machine and Auto soldering station manufacturing, occuping more than 3000 square meters, and continue expanding.
Part of workshop for BGA rework station, Auto screw locking manufacturing
CNC machining workshop for the spare parts of BGA rework station manufacturing
Delivery ,shipping service for the 3 heating zones touch screen BGA reballing station
Details of ordered machine will be confirmed with customers before manufacturing,
some accessories may be needed by personal use(end-user), we would also let them
be told before delivery.
Free training for all customer, no matter who is a distributor, reseller, end-user and sales-after service etc.
FAQ of the 3 heating zones touch screen BGA reballing station
1. Q: How many engineers are for BGA rework station researching and developing?
A: 10 Engineers for BGA rework station, but we have others for Automatic screw locking machine and Auto soldering station etc.
2. Q: How long is your warranty period ?
A: For end-user, 1 year, for distributor, 2 years, but thees heaters will have 3 years warranty now matter who you are .
3. Q: Which express delivery can I choose ?
A: DHL, TNT, Fedex, SF and most of special line.
4. Q: Which country do you not yet sell ?
A: All of countries, we have sold, including those country, such as, Fiji, Brunei and Mauritius that you may have never known.
Know-how about BGA rework station:
(BGA packaging technology)
BGA (Ball Grid Array)－Ball-shaped pin grid array packaging technology, high-density surface mount packaging technology. At the bottom of the package, the pins are all spherical and arranged in a grid-like pattern, hence the name BGA. At present, the motherboard control chipset mostly uses this kind of packaging technology, and the material is mostly ceramic. With BGA-encapsulated memory, the memory capacity can be increased by two to three times without changing the size of the memory. Compared with TSOP, BGA has a smaller size, better heat dissipation performance and better electrical performance. The BGA packaging technology has greatly increased the storage capacity per square inch. The memory products using the BGA packaging technology have the same capacity and only one third of the size of the TSOP package. Compared with the traditional TSOP packaging method, the BGA packaging method has Faster and more effective heat dissipation.
With the advancement of technology in the 1990s, the degree of chip integration has been continuously increased, the number of I/O pins has increased dramatically, and the power consumption has also increased. The requirements for integrated circuit packaging have also become more stringent. In order to meet the needs of development, BGA packaging began to be applied to production. BGA is an abbreviation of English Ball Grid Array Package, which is a ball grid array package.