IR Optical Bga Rework Station For IPhone repair

IR Optical Bga Rework Station For IPhone repair

1 Piece Min. Order Dimensions: 600*700*850mm Weight: 117KG Rated Capacity: 5300W Current: 20A Voltage: AC 110~240 V±10% 50/60Hz Rated Duty Cycle: 100%

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Product Details

Description

Dinghua technology is one of the top ranking manufacturer ,it is one of the fist manufactuer in BGA rework system . focuses on Automatic Soldering Robot, Automatic Screw locking machine, Automatic dispenser machine, Manual&Automatic operation BGA Rework station with solid quality and competitive prices. We already cooperated with many famous company in China and abroad.

 

DH-A2E is an unique style BGA rework station, high definition CCD camera with automatic feeding and picking system , much more convenient in operation . Even heating , precision alignment, high rework success rate is highly praised between customers .

 

A2E big promotion period from September 1st to September 30, 2018

 

A2E video Link :

https://youtu.be/88grJfpwaGw


 

 

 

Parameters

 

1

Total power

    5300w

2        

3 independent heaters                 

 Top hot air 1200w, lower hot air  1200w,   bottom infrared preheating 2700w


3


Voltage


AC220V±10% 50/60Hz



4



Electric parts


7 inch touch screen + intelligent temp control module + stepper motor driver + independent Mitsubishi PLC + LCD display + optical CCD system + laser positioning + industrial joystick


5


Temperature

control


K-Sensor closed-loop + PID automatic temp compensation + temp module,    temp accuracy within ±2℃.


6


PCB positioning


V-groove + universal fixture + movable PCB shelf


7



Applicable PCB size


   Max 370x410mm Min 22x22mm

8

Applicable BGA size

    2x2mm~80x80mm

9


Dimensions

  

    600x700x850mm (L*W*H)


10


Net weight

  

   70 Kg

 

 

 DH-A2E automatic BGA rework station Features

Automatic desoldering, Mounting and Soldering, automatic pick up chip when desoldering completed.

Chip auto feeding system enabled.
HD CCD Optical Alignment system for precisely mounting BGA and Components. CCD lens auto Folding & streching.

Independent MITSUBISHI PLC inside to control movements, movement more stable and accurate.

BGA mounting accuracy within 0.01mm , Repair success rate 99.9%.
Laser Positioning for Fast Positioning BGA Chip and motherboard.

Equipped with top air flow adjust button, to meet the demands of tiny chips.
Superior Safety Functions, with Emergency protection.
User-friendly operation, Multi-functional ergonomic system.

 

What can be repaired?

Detailed specifications



 

Packing details

Certificate

 

Our factory

Our service

  1. We are online 24 hours ;
    2. Offer free spare parts and service within one year warranty

    3.Technology Support: Provide Demo operation video for training;Kindly invite you to visit our factory and enjoy free training

    4. Fantastic after-sales service;
    5.Life-long technical support from well trained staff and engineers.

     

     

     

     

     

 

 

 

 

 

 

 

 

 

 

 

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  • +86-0755-29091822
  • Sales31@dinghua-bga.com
  • 4th Floor, Block 6B, Shengzuozhi Industrial Park, Xinyu Road, Shajin, Baoan, Shenzhen, China
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