BGA Rework Machine In India

BGA Rework Machine In India

1. Made in China BGA Rework Machine in India. 2. Reasonable price for automatic BGA reballing machine with optical alignment. 3. Matured and wide sales network in India. 4. 3-year warranty for heating system.

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Product Details

BGA rework machine in India

bga soldering station

Automatic BGA Soldering Station with optical alignment

1.Application Of Automatic BGA rework machine in India

Work with all kinds of motherboards or PCBA.

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.

2.Product Features of Automatic BGA rework machine in India

Automatic BGA Soldering Station with optical alignment


3.Specification of Automatic BGA rework machine in India

Laser position CCD Camera BGA Reballing Machine

4.Details of Automatic BGA rework machine in India

ic desoldering machine

chip desoldering machine

pcb desoldering machine

5.Why Choose Our Automatic BGA rework machine in India

motherboard desoldering machinemobile phone desoldering machine

6.Certificate of Automatic BGA rework machine in India

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

pace bga rework station

7.Packing & Shipment of Automatic BGA rework machine in India

Packing Lisk-brochure

8.Shipment for Automatic BGA rework machine in India

DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.

9. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 

10. Operation demo of BGA rework machin?

11. Related knowledge

Wetting effect of different types of reflow soldering

By changing the welding environment into a negative pressure welding environment (all temperature zones are processes that can be precisely controlled by atmospheric pressure), we have found that most of the solder wetting problems can be solved perfectly, and the reliability of solder joints is improved.

1. Flux contamination is relatively large, and the residual hazard after cleaning is large. The chloride and sodium ions in the flux residue form a salt when wet steam is formed, corroding the solder joint. Causes problems with open circuit and solder joints. Locations with clean corners are the most prone to problems.

2. The welding process of current reflow soldering equipment is uncontrollable. Military products are characterized by a wide variety and a small number. Some valuable products do not have redundant samples to repeat the reflow profile test. Once the temperature curve parameter setting error or negligence occurs, the welding process of the board inside the furnace is completely uncontrollable, which will directly lead to the scrapping and failure of the product. There is a need for a new type of reflow soldering equipment that not only observes the entire welding process (through visual systems and various sensors), but also allows real-time intervention to control various parameters in the weld. With such a function, even if there is a human error, it can be found and corrected in time during the welding process. Ensure the smooth and safe welding of key products of key models.

3. At present, there may be problems with the card board and the burning board in the reflow soldering equipment, because there are high temperature hot air and transmission system and many sensors in the furnace. Once the transmission system and the sensor have small problems, there may be problems of burning the board. , bringing a lot of losses to the unit. There is no transmission system inside the new reflow soldering, and the soldering of the product is static. There will be no problems with the board and the board. Even if the welding temperature caused by human error is found or exceeds the requirements, the one-button anti-burning board function (quick vacuum) can be used to ensure the safety of the product.

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