Semi-auto Optical BGA Reballing Machine
Production introduction of Semi-auto optical BGA reballing machine This BGA rework station DH-G600 is a semi-auto with imported optical CCD camera ,HD display screen and drawer-style computer with touch screen, used for computer, Xbox, PS3/4 and other PCB etc, also, as it feature with Air flow...
Production introduction of Semi-auto optical BGA reballing machine
This BGA rework station DH-G600 is a semi-auto with imported optical CCD camera ,HD display screen and drawer-style computer with touch screen, used for computer, Xbox, PS3/4 and other PCB etc, also, as it feature with Air flow adjusting knob, so it can repair micro chip, such as, IC , POP and QFN etc.
Product features and application of the semi-auto optical bga reballing machine
Optical CCD camera, imported from Panasonnic, with 2 million pixels, double-colors split and shown on display screen for aligning.
Knob for top head movement, when start to solder or desoldering over, just make top head moved by this knob .
Ruler, 110mm, when aligning for chip and PCB, it can be your reference about how height top head is.
BGA rework machine’s most functional buttons, such as, top/bottom light adjusting for optical CCD camera, top air flow adjusting and zoom in/out for display screen and thermocouple
Emergency button, under any circumstances, if it is pressed down, BGA rework station will stop immediately, also, you can press “start” to start machine.
Drawer-style computer with touch screen( 7 inches), it can save much space, it is a brain of machine, as all of parameters, such as, temperature, time, PID calculating etc.
Product quality of the semi-auto optical bga reballing machine
We take part in the Canton Fair every year, and visited by customer from the USA, Euro and Southeast Asia etc.
Customer, on Canton fair, from UK is concentrating on listening to our technician’s lecture about the BGA rework station working fundamentals.
Some of certifications display, including patents, CE, Certificate of the system of quality certification, Well-known brand and High-tech enterprise certification etc.
Delivery, shipping and service of the semi-auto optical BGA reballing machine
Before delivery: deposit received, for less than 10 sets 3~5 days for preparing, 10~50 sets, 2 weeks for preparing, 50~100 sets , 3 weeks for preparing.
After delivery: if needed, we can help arrange shipping ways for customer, and see which way the most cost-effective, when machine received, we will guide how to install and operation.
FAQ of the semi-auto optical bga reballing machine
1. Q: what is a BGA rework station?
A: a hot air/IR station is used to heat devices and melt solder, and specialised tools are used to pick up and position often tiny components.
2.Q: What temperature do you need to Desolder?
A: Usually , the lead solder ball to be desoldered, the temperature can be set a lower, if lead-free solder ball , the temperature needs to be set higher , but Remember if the temp is too low to melt the solder,it can be set not more than 400C° If yos till struggle with it, just add some of solder to the mounted components, then works.
3.Q: What is the “BGA”?
A:ball grid array(BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.
4. Q:What is the best temperature in soldering？
A:The melting point of most solder is in the region of 188°C (370°F) and the hot air temperature is set 160°C to 280°C (320°F to 536°F). usually, temperature should always start at the lowest temperature possible.
Latest news of the semi-auto optical BGA reballing machine
1.Clean the area.
2.Drill into delamination blister with the Micro-Drill and ball mill. Drill in an area clear of circuitry or components. Drill at least two holes opposite each other around the perimeter of the delamination. (See Figure 1). Brush away all loose material.
Be careful not to drill too deep exposing internal circuits or planes.
Abrasion operations can generate electrostatic charges.
3. Bake the PC board to remove any entrapped moisture. Do not allow the PC board to cool prior to injecting the epoxy.
Some components may be sensitive to high temperature.
4.Mix the epoxy. See manufacturers instructions on how to mix epoxy without bubbles.
Exercise care to prevent bubbles in the epoxy mixture.
5. Pour the epoxy into the epoxy cartridge.
6. Inject the epoxy into one of the holes in the delamination. (See Figure 2). The heat retained in the PC board will improve the flow characteristics of the epoxy and will draw the epoxy into the void
area filling it completely.
7. If the void does not fill completely, the following procedures may be
A. Apply light local pressure on the board surface starting at the fill hole, slowly proceeding to the vent hole.
B. Apply vacuum to the vent hole to draw the epoxy through the void.
8. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling.
9. Scrape away any excess epoxy using the Precision Knife or Scraper.