Full-auto Optical BGA Reballing Machine
Full automatic optical BGA reballing machine This machine DH-A4D is full automatic, chip feeder can be used for chip (1*1~80*80mm), when chip’s positioning set, the vacuum pen in top head can pick it up at the right position, optical CCD lens can move leftward, rightward, rearward or backward,...
Full automatic optical BGA reballing machine
This machine DH-A4D is full automatic, chip feeder can be used for chip (1*1~80*80mm), when chip’s positioning set, the vacuum pen in top head can pick it up at the right position, optical CCD lens can move leftward, rightward, rearward or backward, the high-end machine is especially used for factory, Universal Lab and assembly line etc.
Product parameter of full automatic optical BGA reballing machine
2nd 1200W, 3rd German IR heater 4200W
Double joysticks operation. Fully automatic positioning, soldering, cooling, integration..
Optical CCD camera lens
Automatic Frontward / backward, right / left, or manual by joysticks, imported from Panasonnic
Full automatic, application for chip 1*1~80*80mm
10x - 220x
±15mm forward/backward,±15mm right/left
Laser position, fast and accurate position of pcb and bga
BGA chip angle adjusting
Top air flow speed
adjusted by adjusting knob, prevent tiny bga from being moved
Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groove pcb bracket + universal fixtures, spring installing on PCB workbench, protecting PCB from being deformed .
K sensor, close loop
PLC control, Servo driver
Taiwan led working light, any angle adjustable
Temperature profile storage
Max 410×450 mm Min 22×22 mm
2x2 - 80x80 mm
Minimum chip spacing
External temper sensor
Product details of full auto optical BGA reballing machine
Optical CCD lens, it is imported from Panasonnic, featuring with HD imaging, full automatic moved in X and Z direction,also, the chip feeder is full auto just like
Optical CCD lens.
Infrared preheating area, carbon fiber heating tubes, anti high temperature glass shield, and whole of IR preheating area can be moved leftward or rightward.
BGA rework station’s industrial PC, for PID and PLC setting, working and operating etc.
Full automatic BGA rework station dimension, reasonable design and powerful function are necessary for your high successful rate to rework.
Before delivery: buyers, end user can come to us for free training, and learn how our
Procedures are about machine vibrating for testing and checking etc.
After delivery, providing skilful guide for user to install and operate, even though know-how to eliminate some small problem when using.
FAQ of full auto optical BGA reballing machine
1.Q: if i come to your factory, can you pick me up at Airport?
A: Yes, we are near the air port.
2.Q: Can you help me translate the Language into my mother tongue?
A: Yes, if there is massive quantity, it would be free that.
3.Q:Can I purchase these accessories from you?
A:Yes, there are solder ball, solder wick, BGA flux and reballing kit etc.
4.Q: Can I get these machine with duty free?
A:If these BGA rework stations are shipped to Euro and Russia or the Soviet Union by train or land transportation, it’s OK, other countries, it depends on.
Latest news of full auto optical BGA reballing machine
This procedure uses a solvent to remove surface coatings. This procedure can be use for spot or overall coating removal of conformal coatings or solder resists.
Approved solvents may be used to remove specific soluble type coatings on a spot basis by brushing or swabbing the local area with the controlled application of solvent until the area is free of the coating material.
If warranted, all the soluble type coating can be removed by immersing and brushing the entire printed board or printed board assembly.
To determine the appropriate coating removal procedure the coating must first be identified. Refer to procedure number.
Coating removal may require the use of one or more methods.
Determine, on a module by module basis, the hazards to parts, etc., by short term immersion in the removal solvents. If chloride based or other harsh solvents are used, extreme care must be exercised to prevent damage to base material, component parts, plated-through holes, and solder joints. Some solvent coating removal methods can cause expansion or swelling of the base material which can degrade the printed board or printed board assembly. Under no circumstances should these solvents be used except in a closely controlled process. It is recommended that the printed board or printed board assembly be inspected to ensure that no damage has occurred.
Before using any solvent refer to Material Safety Data Sheets
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