Full-auto Optical BGA Reballing Machine

Full automatic optical BGA reballing machine This machine DH-A4D is full automatic, chip feeder can be used for chip (1*1~80*80mm), when chip’s positioning set, the vacuum pen in top head can pick it up at the right position, optical CCD lens can move leftward, rightward, rearward or backward,...

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Product Details

Full automatic optical BGA reballing machine

 

This machine DH-A4D is full automatic, chip feeder can be used for chip (1*1~80*80mm), when chip’s positioning set, the vacuum pen in top head can pick it up at the right position, optical CCD lens can move leftward, rightward, rearward or backward, the high-end machine is especially used for factory, Universal Lab and assembly line etc.

 

Product parameter of full automatic optical BGA reballing machine

 

Total Power

6800W

Top heater

1200W

Bottom heater

2nd 1200W, 3rd German IR heater 4200W

Power

110~220V±10% 50/60Hz

Operation mode

Double joysticks operation. Fully automatic positioning, soldering, cooling, integration..

Optical CCD camera   lens

Automatic Frontward / backward, right / left, or manual by joysticks, imported from Panasonnic

Chip feeder

Full automatic, application for chip 1*1~80*80mm

Camera   magnification

10x - 220x

Workbench fine-tuning:

±15mm forward/backward,±15mm right/left

BGA positioning

Laser position, fast and accurate position of pcb and bga

BGA chip angle adjusting

Max 60°

Top air flow speed

adjusted by adjusting knob, prevent tiny bga from being moved

PCB Positioning

Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groove pcb bracket + universal fixtures, spring installing on PCB workbench, protecting PCB from being deformed .

Temperature control

K sensor, close loop

Placement accuracy:

±0.01mm

Running methods

PLC control, Servo driver

Temp accuracy

±1℃

Lighting

Taiwan led working light, any angle adjustable

Temperature profile storage

50000 groups

PCB size

Max 410×450 mm Min 22×22 mm

BGA chip

2x2 - 80x80 mm

Minimum chip spacing

0.15mm

External temper sensor

4pc

Dimensions

700x700x950mm

Net weight

95KG

 

Product details of full auto optical BGA reballing machine

optical CCD lens for bga rework station.jpg

  Optical CCD lens, it is imported from Panasonnic, featuring with HD imaging, full automatic moved in X and Z direction,also, the chip feeder is full auto just like

Optical CCD lens.

IR preheating area.jpg 

Infrared preheating area, carbon fiber heating tubes, anti high temperature glass shield, and whole of IR preheating area can be moved leftward or rightward.

computer PID controlling.jpg

BGA rework station’s industrial PC, for PID and PLC setting, working and operating etc.

BGA rework station dimenssion.jpg

Full automatic BGA rework station dimension, reasonable design and powerful function are necessary for your high successful rate to rework. 

 

Delivery, shipping and service of full auto optical BGA reballing machine

Before delivery: buyers, end user can come to us for free training, and learn how our

Procedures are about machine vibrating for testing and checking etc.

After delivery, providing skilful guide for user to install and operate, even though know-how to eliminate some small problem when using.

 

FAQ of full auto optical BGA reballing machine

1.Q: if i come to your factory, can you pick me up at Airport?

A: Yes, we are near the air port.

2.Q: Can you help me translate the Language into my mother tongue?

A: Yes, if there is massive quantity, it would be free that.

3.Q:Can I purchase these accessories from you?

A:Yes, there are solder ball, solder wick, BGA flux and reballing kit etc.

4.Q: Can I get these machine with duty free?

A:If these BGA rework stations are shipped to Euro and Russia or the Soviet Union by train or land transportation, it’s OK, other countries, it depends on.

 

Latest news of full auto optical BGA reballing machine

This procedure uses a solvent to remove surface coatings. This procedure can be use for spot or overall coating removal of conformal coatings or solder resists.

Approved solvents may be used to remove specific soluble type coatings on a spot basis by brushing or swabbing the local area with the controlled application of solvent until the area is free of the coating material.

If warranted, all the soluble type coating can be removed by immersing and brushing the entire printed board or printed board assembly.

To determine the appropriate coating removal procedure the coating must first be identified. Refer to procedure number.

 

NOTE 

Coating removal may require the use of one or more methods.

 

CAUTION 

Determine, on a module by module basis, the hazards to parts, etc., by short term immersion in the removal solvents. If chloride based or other harsh solvents are used, extreme care must be exercised to prevent damage to base material, component parts, plated-through holes, and solder joints. Some solvent coating removal methods can cause expansion or swelling of the base material which can degrade the printed board or printed board assembly. Under no circumstances should these solvents be used except in a closely controlled process. It is recommended that the printed board or printed board assembly be inspected to ensure that no damage has occurred.

Before using any solvent refer to Material Safety Data Sheets

 

TOOLS & MATERIALS

Brush

Foam Swab

Precision Knife

Suitable Solvent

Tape, High Temperature

Thermal Parting Tool

Wood Stick

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