2 Heating Zones Keyboard BGA Reballing Machine
2 heating zones keyboard bga reballing machine Full IR BGA rework station with 2 heating areas, being suited for a large size chip(less than 80*80 mm), and those PCB, such as, TV, Gaming console and computer etc. Production parameter Product details Top IR heater, 80*80 mm, used for almost all...
2 heating zones keyboard bga reballing machine
Full IR BGA rework station with 2 heating areas, being suited for a large size chip(less than 80*80 mm), and those PCB, such as, TV, Gaming console and computer etc.
1800W,fully enclosed in a glass-shielded compartment
Top head movement
Up / down, rotate freely.
Taiwan led working light, any angle adjusted.
Store 10 groups of temperature profile
V-groove, PCB support can be adjusted in X, Y direction with external universal fixture
K Sensor, Closed loop
Max 270 * 320 mm Min 20* 20 mm
Minimum chip spacing
External temper sensor
Top IR heater, 80*80 mm, used for almost all of chip to heat up
Be widely used for motherboards with big size up to 270*320 mm
Bottom IR fully enclosed in a glass-shielded
Instrument Panel for temperature and time setting, easy to operate and use conveniently
Imported heater, high quality, durable.
Taiwan infrared preheating ceramic plate, glass guard.
Adopt two heating zone, upper heater is infrared, lower heater is infrared
K type close loop control, the temperature accuracy will be on ±2°C
With outer sensor connector, detect actual temperature when heating.
Sound hint system: there is voice reminder 5s-10s before the completion of heating,which let operator prepare.
Before delivery: Machine will be vibrated testing for at least 12 hours before delivery, after that, make machine tested again, see it is OK.
After delivery: when machine arrived at your custom, we will email, call or WhatsApp to you for goods being processed in time.
Machine received: Providing you technique to install and operate etc.
A: How to pack ?
Carton case and foam inside
A: Are you a factory ?
Of course, we are a factory, and have our own R&D department, and dust-free workshop
A: If I ordered massive quantity, can i get a much better price?
Yes, please just contact us
A: Can I visit to your workshop ?
Yes, it’s OK, please let us know in advance.
Handling Electronic Assemblies
Electrostatic Discharge (ESD)
Certain components used in electronic assemblies are sensitive to static electricity and can be damaged by its discharge. Static charges are created when non-conductive materials are separated, such as when plastic bags are picked up or opened, when friction occurs between articles of synthetic clothing, when plastic tapes are dispensed and many other causes.
Destructive static charges are induced on nearby conductors, such as human skin, and delivered in the form of sparks passing between conductors, such as when the surface of printed board assembly is touched by a person having a static charge potential. If touched at the right solder joint or conductive pattern, the PC board assembly can be damaged as the discharge passes through the conductive pattern to a static sensitive component. It is important to note that usually the static damage level for components cannot be felt by humans. (Less than 3,000 volts.)
Electrical Overstress (EOS)
Electrical overstress damage can be caused by generation of unwanted energy; such as spikes, occurring within soldering irons, solder extractors, testing instruments and other electrically operated equipment. This equipment must be designed as to prevent unwanted electrical discharges.
ESD/EOS Safe Work Areas
The purpose of an ESD/EOS safe work area is to prevent damage to sensitive components from spikes and static discharges. These areas must be designed and maintained to prevent ESD/EOS damage.
Handling and Storage Methods
1. PC board assemblies must always be handled at properly designated work areas.
2. Designated work areas must be checked periodically to ensure their continued safety from ESD. Areas of main concern include:
A.Proper grounding methods.
B.Static dissipation of work surfaces.
C.Static dissipation of floor surfaces.
D.Operation of ion blowers and ion air guns.
3.Designated work areas must be kept free of static generating materials such as Styrofoam, vinyl, plastic, fabrics or any other static generating materials.
4. Work areas must be kept clean and neat. To prevent contamination of PC board assemblies, there must be no eating or smoking in the
5. When not being worked on, sensitive components and PC boards must be enclosed in shielded bags or boxes.
6. Whenever handling a PC board assembly the operator must be properly grounded by one of the following:
A. Wearing a wrist strap connected to earth ground.
B. Wearing 2 heal grounders and have both feet on a static dissipative floor surface.
7. PC board assemblies should be handled by the edges. Avoid touching the circuits or components. (See Figure 1).
8. Components should be handled by the edges when possible.Avoid touching the component leads. (See Figure 2).
9. Hand creams and lotions containing silicone must not be used since they can cause solderability and epoxy adhesion problems. Lotions specifically formulated to prevent contamination of PC boards are available.
10. Stacking of PC boards and assemblies should be avoided to prevent physical damage. Special racks and trays are provided for handling.